1.
Principles & Design of Micro-electronics Apparatus
微电子器件原理与设计
2.
Course Design of Micro-electronics Apparatus
微电子器件课程设计
3.
The science, technology, or operation of designing and/ or producing microelectronic devices.
设计和(或)生产微电子器件的科学、技术或作业。
4.
Study of Fabricating Silicon-tip Field Emission Array Used in Micravacuum Devices
真空微电子器件中的场发射硅尖阵列制作研究
5.
Percolation Methodology for the Modeling and Simulation of the Reliability Issues of Microelectronics Devices;
微电子器件可靠性建模与仿真的逾渗分析方法
6.
A Study of Removal Techniques of Contamination on Si Wafers in Microelectronics;
微电子器件硅衬底表面污染物去除技术的研究
7.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
8.
Characteristics and Suppression of Multipactor Discharge in Microwave Space Systems;
空间微波器件二次电子倍增放电的特性与抑制
9.
microelectronic modular assembly
微电子学微型组件装置
10.
electron microscope microanalyser
电子显微镜微量分析器
11.
electron micrograph
电子微写器;电子显微放大器;电子显微镜相片;电子显微镜照片
12.
A Study on Laser Micro Machining Technology and Equipment for Electronic Components;
电子元器件的激光微细加工技术及设备研究
13.
Algorithm for automatic counting tiny electronic device based on digital image processing
基于图像处理的微小电子元器件自动计数算法
14.
Application of High Temperature Superconducting in the EW System
高温超导微波器件在电子战接收机中的应用
15.
Performance Analysis and Application of Electron-Multiplied-CCD
电子倍增CCD微光传感器件性能及其应用分析
16.
The CPU is a microprocessor containing millions of electrical components.
中央处理器是一个包含数百万电子元器件的微处理器。
17.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
18.
Research of Coaxial Percent Detection System of Micro Electronic Components Based on Machine Vision;
基于机器视觉的微小型电子元器件同心度检测系统的研究