1.
Monocrystalline germanium slices
GB/T15713-1995锗单晶片
2.
single wafer plasma system
单晶片处理式等离子装置
3.
Research of Polished Technology of VB GaAs Wafers
VB-GaAs单晶片抛光技术研究
4.
" Indium antimonide polycrystal, single crystals and as-cut slices"
GB/T11072-1989锑化铟多晶、单晶及切割片
5.
Monocrystalline silicon ascut slices and lapped slices
GB/T12965-1996硅单晶切割片和研磨片
6.
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
7.
The Czochralski silicon monocrystalline polished wafer with a diameter of eight inches
8英寸直拉硅单晶抛光片
8.
Polished monocrystalline sapphire substrates
GB/T13843-1992蓝宝石单晶抛光衬底片
9.
Boat-grown gallium arsenide single crystals and As-cut slices
GB/T11094-1989水平法砷化镓单晶及切割片
10.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
11.
Study on Single Crystal MgO Substrates Lapping and Its Damage;
单晶MgO基片研磨工艺及其损伤研究
12.
An Experimental Study of the Polishing Process for MgO Single Crystal Substrate;
单晶MgO基片抛光工艺的实验研究
13.
Study on CMP Technology of Single Crystal MgO Substrates for High Temperature Superconductors;
单晶MgO高温超导基片CMP工艺的研究
14.
A Simulant Experiment Study of the Silicon s Mechanism in the CMP;
单晶硅片CMP磨损机理的模拟试验研究
15.
Application of the LCM2004B liquid crystal monitor in the single chip computers;
LCM2004B液晶显示器在单片机系统中的应用
16.
Interface Technology of MCU and Three Kinds of Liquid Crystal Display
单片机与3种液晶显示器的接口技术
17.
Material removal characteristic of silicon wafers in chemical mechanical polishing
单晶硅片化学机械抛光材料去除特性
18.
Design of the thyristor AC voltage regulator controller based on single chip microcomputer
基于单片机的晶闸管交流调压器设计