1.
Study on the Microstructure、Properties and Interfacial Reaction of Sn Based Lead-free Solder;
Sn基无铅钎料组织、性能和界面反应行为的研究
2.
The Effect of Processing Property and Interface Behavior in the Joints of the Sn-based Lead Free Solder with Additional Elements;
添加元素对Sn基无铅钎料工艺性能及接头区界面行为的影响
3.
Effect of Ge on Oxidation Resistance of Sn-0.3Ag-0.7Cu Lead-free Solder
Ge对Sn-0.3Ag-0.7Cu基无铅钎料抗氧化性影响
4.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
5.
Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements
纳米结构强化的新型Sn-Ag基无铅复合钎料
6.
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
7.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
8.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
9.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
10.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
11.
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
12.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
13.
The Study of the Effect of Sb on Sn-0.7Cu Lead-free Solder;
Sb对Sn-0.7Cu无铅钎料性能影响的研究
14.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
15.
Wettability test of Sn-0.7Cu-xAg-yBi lead-free solder
Sn-0.7Cu-xAg-yBi无铅钎料润湿性试验
16.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
17.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
18.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析