1.
Technological Fundamentals of Semiconductor Device
半导体器件工艺原理
2.
Study on HVMOS Device Technology Compatible with Conventional CMOS Process;
与常规CMOS工艺相兼容的高压MOS器件工艺研究
3.
Fabrication and Study of Instrument Without the Optical Power and Its Improvement of Structural Research;
光无源器件工艺分析及结构改进研究
4.
APPLICATION OF ION BEAM MILLING TECHNIQUE TO JOSEPHSON DEVICE TECHNOLOGY
离子束刻蚀技术在约瑟夫逊器件工艺中的应用
5.
Device Modeling for 0.35μm BiCMOS Technology
0.35μm BiCMOS工艺的器件建模
6.
fabricating technique for exclusive part ofvacuum electron device
真空电子器件专用零件加工工艺
7.
Study on Materials and Processes of Strained Si MOSFETs;
应变硅MOS器件的材料和工艺研究
8.
Study the Structure of the Key Parts of LC～2MOS Technology;
LC～2MOS工艺关键器件结构研究
9.
The Effects of Process Parameters on the Characteristics of TVS;
工艺参数对TVS器件电性能的影响
10.
Structure Analysis and Manufacturing Technique of RC-GCT Device
逆导型GCT器件结构分析及制造工艺
11.
Reliability for Microcantilever Device Manufacture Craft
微悬臂梁器件制作工艺的可靠性研究
12.
Emitting Analysis of U Type Si LED Based on Standard CMOS Technology
标准CMOS工艺U型Si LED器件发光分析
13.
Stamping Process of Glass Lift Outer Covering of Automobile Door
汽车车门玻璃升降器外壳件冲压工艺
14.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
15.
Development of Thermodynamic Calculation Program and Engineering Application of Compressor Cooler
压缩机冷却器工艺计算软件研制及其工程应用
16.
The Study of Fabrication Technics and Structure Optimization of Organic Light-emitting Devices;
有机电致发光器件的制备工艺研究及器件结构优化
17.
Study on Fabrication Process of Organic Electroluminescence Device and High Efficiency Phosphorescent OLED Performance;
有机电致发光器件制备工艺与高效磷光器件性能的研究
18.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术