1.
Study on Theory and Method of Intelligent Optimal Design for Cartridge Manifold Block;
插装式集成块智能优化设计理论与方法研究
2.
dual in line integrated circuit
双列直插式集成电路
3.
dip integrated circuit
双列直插式外壳集成电路
4.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
5.
in line ic processor
吝式集成电路加工装置
6.
Research and Implementation of Automatic Generation of Assembly Drawing for Hydraulic Manifold Block;
液压集成块装配图智能化生成技术研究与实现
7.
Thermal-structural-optical integrated analysis of segmented space telescope
分块式空间望远镜的光机热集成分析
8.
Research on EMI Shielding Inside Hybrid Intergrated Power Electronic Module
混合封装电力电子集成模块内电磁干扰的屏蔽
9.
Research and Development on Hydraulic Manifold Block Virtual Assembly Simulation System;
液压集成块虚拟装配仿真系统研究与开发
10.
Research on the Modeling of Hydraulic Manifold Block in Virtual Assembly Environment;
液压集成块虚拟装配环境建模方法研究
11.
Research on Integration of the Vision and Motion Parts in Pre-Bonding Module of RFID Packaging Machine;
RFID封装线预绑定模块的视觉与运动集成研究
12.
Research on key technology of hydraulic manifold block assembly process simulation system
液压集成块装配过程仿真系统关键技术研究
13.
Application of high-performance integrated module in the marine torque measurement device
船舶扭矩测量装置中高性能集成模块的运用
14.
Modeling of parasitic parameters for integrated power electronics module using flip chip technology
倒装芯片集成电力电子模块寄生参数的建模
15.
pin-type automatic linkage
插销式自动联接装置
16.
ceramic dual in-line package
陶瓷双列直插式封装
17.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
18.
bound task set load module
已连接任务集装入模块