1.
A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure analysis.
扫描声学显微镜可以用来检测封装分层，能在失效分析的早期阶段快速地鉴别失效原因。
2.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
3.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
4.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
5.
Stress Finite Element Analysis and Structure Optimization in a Stacked Chip Size Package;
叠层CSP封装结构应力有限元分析及结构优化
6.
Numerical Simulation Study and Application of Interface Delamination in High Density Electirc Packaging;
高密度芯片封装中界面分层的数值模拟研究及其应用
7.
ASL provides interfaces to send and receive message for upper applications, and MTL responds to the encapsulation and distribution of messages.
会话层向上层应用提供发送和接受消息的接口,传输层负责消息的封装和分发。
8.
Data encapsulation and multi-tiered design go hand in hand.
即，将数据封装和多层设计结合起来。
9.
Research on Physical Frame Capsulation Sublayer in Border Node of Supanet;
SUPANET边界节点中物理帧封装子层的研究
10.
Comparison between Two Electrodes for High-Power LED Packaging
两种新型大功率LED封装电极层的比较
11.
Which of the following are data link layer encapsulation details?( Choose two.
(如下内容中的哪些是资料连结层封装细节?
12.
Multiplayer bonding technique for high power diode laser
高功率二极管激光器封装的多层焊接技术
13.
Gravel Asphalt Sealing Layer Technology Construction Technology and Construction Equipment Use
沥青碎石封层技术的施工工艺与施工装备运用
14.
Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package
无铅封装中镀覆层对PBGA耐湿热可靠性的影响
15.
Ten letters that belong in 10 particular envelopes are scrambled and stuffed and mailed at random.
将十封分属十个信封的信打乱，任意装进信封，并随便投邮。
16.
wages enclosed in an envelope for distribution to the wage earner.
分发工资时装工资的信封。
17.
Analysis and Implementation of WiMAX Encryption Package Protocol;
WiMAX加密封装协议的分析与实现
18.
Power/Ground Planes Analysis and Optimization in Package and PCB;
封装和PCB上电源/地平面的分析和优化