1.
GZ Polymer Alloy Membrane Cast-in-place Reinforced Concrete Hollow Floor Quality Control
GZ高分子合金组合芯模现浇空心楼盖施工质量控制
2.
Application of Combinative Core in Investment Casting Mold Design for Expansion Arm Casting
组合型芯在扩张臂熔模铸造模具设计中的应用
3.
Simulation Method in Single Chip Systems_5. An Example for Designing Component Simulation Softwaer
芯片模拟仿真方法——5.组合模拟仿真软件设计实例
4.
Design of 16 S rRNA-based Oligonucleotide Array Using Group-specific Non-unique Probes in Large Scale Bacteria Detection
基于组合探针识别的大规模细菌分类16 S rRNA基因芯片设计(英文)
5.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
6.
MECHANICAL PROPERTIES OF SIMPLE COMPOSITE TRUSS WITH SANDWICH PANEL
简支组合桁架夹芯板的力学性能研究
7.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
8.
Demoulding Structural Design of Core Cooperating Pushing Plate Dual-Corn
型芯与推板双锥面配合脱模机构设计
9.
Identification of Differentially Expressed Genes in the Development and Progression of Human Hepatocellular Carcinoma by cDNA and Tissue Microarray Techniques;
基因芯片联合组织芯片探讨原发性肝癌发生发展的分子机制
10.
Numerical Simulation of the Truss Core Panels in Investment and Low Pressure Die Casting
高温合金点阵夹芯板低压熔模铸造数值模拟
11.
Numerical Analysis on Vertical Bearing Behavior of JPP Pile Group
高喷插芯组合群桩竖向承载特性的数值分析
12.
Application of Gray System Theory on Prediction of Ultimate Bearing Capacity of Jet Grouting Soil-Cement-Pile Strengthened Pile
高喷插芯组合桩极限承载力的灰色预测
13.
The Application of Water Soluble Ceramic Core in Alluminum Plycast Castings
水溶性陶瓷芯在铝合金熔模铸造中的应用
14.
Hydraulic protection against rotation of rotatable screw-demolding core under mould clamping
可转动型芯在合模后的防转动液压保护
15.
Experimental Study and Numerical Simulation on the Composite Pile with Cast-In-Place Core;
现浇刚性芯复合桩试验研究及数值模拟
16.
The Researches on Mixed-Signal Test and Design for Testability;
数模混合信号芯片的测试与可测性设计研究
17.
Hybrid System Design for Microarray and Mass Spectrometry Data Analysis;
用于基因芯片和质谱数据分析的混合模型研究
18.
Research and Design of RFID Analog Circuits for the Standard ISO/IEC 15693;
符合ISO/IEC 15693标准的RFID芯片模拟电路设计研究