1.
An Electrochemical and STM Study of Fluorosurfactant FSN Self-assembly on Gold Single Crystal Surfaces
氟表面活性剂FSN在金单晶表面自组装的电化学和扫描隧道显微术研究
2.
Microstructure of Surface Recrystallization of Single Crystal Superalloy DD6
单晶高温合金DD6表面再结晶组织
3.
Study of the Surface Integrity of the Crystal High-temperature Alloys DD6 in Vacuum Heat Treatment
单晶高温合金DD6真空热处理表面完整性研究
4.
Recrystallization on Interface between NiCoCrAlYTa Coating and Nickel-Based Super-Alloy
NiCoCrAlYTa涂层/镍基单晶高温合金界面再结晶
5.
2D Waveletanalysis on KDP Crystal Surface Micro-Topography by SPDT;
KDP晶体单点金刚石切削表面微观形貌的二维小波分析
6.
Study on Surface Characters of Gem Diamond Crystals Grown by HPHT
高温高压生长宝石级金刚石单晶的表面特征研究
7.
Surface, Interface and Dislocation Behaviors of CdZnTe Single Crystals;
CdZnTe单晶表面、界面及位错的研究
8.
The clad diamond with multilayer films of metals, alloys or metalceramics are manufactured by low-temperature plasma composite technology.
采用该技术可以在单晶金刚石颗粒表面获得强力结合的多层金属层、金层及陶瓷涂层。
9.
Oriented Cutting (001) and (011) Crystalline Planes of Nickel-base Single Crystal Superalloy
镍基单晶高温合金(001)和(011)晶面的定向切割
10.
Study on High Quality Surface Protection of Single Crystal MgO Polishing Substrate;
单晶MgO抛光基片高质量表面保护研究
11.
Surface Quality Study of Sapphire Crystal Grinded by Electrolytic In-Process Dressing (ELID) Method;
蓝宝石单晶ELID磨削表面质量研究
12.
Reflection of the Incidence O-Ray on the Internal Boundary Surface of Uniaxial Crystal;
单轴晶体内表面入射o光线的双反射
13.
Research on Growth Interface of Diamond Crystal under the High Pressure and Temperature Environment;
高温高压条件下金刚石单晶生长界面的研究
14.
Evolution of interphase misfit dislocation networks in Ni-based single-crystal superalloy
镍基单晶高温合金相界面错配位错网络的演化
15.
Synthesis and Characterization of Metal Sulfide Monodisperse Nanocrystals;
金属硫化物单分散纳米晶的制备和表征
16.
Calculations of apparent activation energy of diamond single crystals synthesized by iron-based catalyst
铁基触媒合成金刚石单晶的表观活化能计算
17.
Crystal Structure and Characterization of an Iridium(Ⅲ) Complex:(btfmp)_2Ir(dbm)
金属铱(Ⅲ)配合物(btfmp)_2Ir(dbm)单晶结构及表征
18.
Study on the Surface Layer Damage of Monocrystalline Silicon Wafer Induced by Ultra-precision Grinding;
单晶硅片超精密磨削加工表面层损伤的研究