1.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
2.
Analysis on Mechanical Behavior of BGA Solder Joints under Shock Loading;
冲击载荷下BGA封装焊点的力学特性研究
3.
BGA Assembly Technology Research for Solder Ball's Reliability
对BGA封装技术中锡球焊接可靠性的研究
4.
Analysis on Thermal Stress and Thermal Reliability of BGA Packaging
BGA封装的热应力分析及其热可靠性研究
5.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
6.
Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package
ESPI在板级BGA封装器件焊球失效检测中的应用
7.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究
8.
Defects Inspection and MATLAB Simulation of Chips BGA Packages Based on Machine Vision
基于机器视觉的芯片BGA封装焊球缺陷检测及MATLAB仿真
9.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
10.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
11.
Vacuum Pen device is used to lift up and place BGA from/ on mainboard to meet BGA non-touch nature.
真空吸放笔装置,实现零作用力吸放功能,符合BGA免触的特性,无损拆焊的组件。
12.
sealing device [ballot box]
封箱装置〔投票箱〕
13.
Front Oil Seal Installer 6635
前油封安装器6635
14.
Design of GFP Encapsulation and De-encapsulation Module in EoS
EoS中GFP封装与解封装模块的设计
15.
Design of GFP encapsulation and de-encapsulation in EoS system
EoS系统中GFP封装与解封装的设计
16.
The letter was contained in a bottle fast as a Kentish oyster.
那封信装在一只高度密封的瓶子里。
17.
cask-filling, closing, sealing or labeling cachine
用于桶装填、封口、密封或贴标签的机器
18.
the seal of the air-balancing cylinder adopts multi-stage seal;
气平衡缸密封部位采用多级密封装置 ;