1.
Research and Implementation of Encapsulating OpenSSL by COM;
OpenSSL的组件化封装研究与实现
2.
Development of Anti-aging Coating for Rubber Parts of Armored Equipment
装甲装备橡胶密封件抗老化封存膜的研制
3.
Design and Encapsulation Ajax Components Based on ASP.NET
基于ASP.NET的Ajax组件的设计与封装
4.
Design and Realization of GIS Component Based on MapObjects
MapObjects组件二次封装的设计与实现
5.
A technique of converting web documents into component based on wrapper
一种基于封装器的Web文档构件化技术
6.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
7.
This equipment is made up of kiln body, support device, supporting device with shelf, moving kiln head, sealing device for kiln tail, burning device and etc. parts.
该设备由筒体、承装置、档输支承装置、动装置、动窑头、尾密封装置、烧装置等部件组成。
8.
This is true information encapsulation, and ensures that the object can be used as a software component.
这样的一种信息封装确保了对象能够作为软件组件来使用。
9.
The Application of Dry Gas Seal in Air Compressor of the Catalytic Installation;
干气密封在催化装置气压机组上的应用
10.
&Install Component...
安装组件(&I)...
11.
Study on Protel DXP Packaging Components Library
Protel DXP元件封装库的研究
12.
Preparation, Supramolecular Encapsulation, and Self-assembly of Hyperbranched Polymers;
超支化聚合物的合成及其超分子封装和超分子自组装研究
13.
Research on the Reliability of Solder Joints in Mixed Assembly and Structure Parameter Optimization of PBGA in Lead-free Transition
无铅过渡时期混合组装PBGA焊点可靠性及封装体结构参数优化研究
14.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
15.
Characteristics simulation of MEMS packaging using multichip modules technology
基于微机械系统的多芯片组件封装和特性模拟(英文)
16.
Later, components and objects evolved allowing for the encapsulation of data (member variables) within them.
后来，组件盒对象发掌起来，使数据可以封装在里面。
17.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
18.
Application Component Layer envelops the parallel algorithms of matrix-vector operation to offer users high-level interfaces;
其中应用组件层把矩阵向量运算的并行算法封装成类组件,为用户提供了高层次的接口;