1.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
2.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
3.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
4.
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
5.
Numerical Simulation Study and Application of Interface Delamination in High Density Electirc Packaging;
高密度芯片封装中界面分层的数值模拟研究及其应用
6.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
7.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
8.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
9.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
10.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
11.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
12.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
13.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
14.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
15.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
16.
Wrapper Design Based on Partial Overlapping Test Slices
基于部分重叠片段的并行测试封装设计
17.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
18.
Research on Friction Analysis and Compensation for the High-Speed & High-Accuracy IC Packaging Platform;
高速高精芯片封装平台的摩擦分析及补偿研究