1.
Microstructure and Properties of Rapidly Solidified Cu-Sn Hypoperitectic Alloys;
快速凝固Cu-Sn亚包晶合金的微观结构与性能
2.
Research on the Directionally Solidified Microstructure of Cu-Sn Peritectic Alloys;
Cu-Sn包晶合金定向凝固组织研究
3.
The Preparation and Mechanisms Study of Cu-Sn Alloy Coated Ferrous Powder
Cu-Sn合金包覆铁粉末的制备及机理研究
4.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
5.
Effect of Grain Boundary Segregation of Residual Elements Cu-As-Sn on Intergranular Embrittlement Fracture of Low Alloying Steel
低合金钢残余元素Cu-As-Sn的晶界偏析对晶间脆性断裂的影响
6.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
7.
Microstructure and Phase Selection in the Unidirectional Solidification of Zn-Cu Peritectic Alloy;
Zn-Cu包晶合金定向凝固组织及相选择
8.
Microstructure Evolution of Zn-(2.00～4.00)%Cu Peritectic Alloy;
Zn-（2.00～4.00）%Cu包晶合金凝固组织的演变
9.
The Experiment and Theoretics Study of Viscosity of Cu-Sn Alloys;
Cu-Sn合金熔体粘度的实验与理论研究
10.
Study on rapid solidification welding techniques of quenched Cu-Sn alloy foils
急冷Cu-Sn合金箔快速凝固连接工艺
11.
Process for Electroplating of Pb-Sn-Cu Ternary Alloy Coating
Pb-Sn-Cu合金共沉积工艺研究
12.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
13.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
14.
Research on Electroplating Techonology and Mechanism of Sn-Ag-Cu Alloy Coatings;
电沉积Sn-Ag-Cu合金工艺及沉积机理研究
15.
Microstructure of Al-20% Sn-4.5% Cu alloy during high energy ball milling and sintering processes
Al-20% Sn-4.5% Cu合金在高能球磨和烧结中的组织
16.
Preparation of Cu-Sn alloy anodes by reductive co-precipitation method and their electrochemical performance
Cu-Sn合金共还原法制备及电化学性能研究
17.
Microstructural characteristic of rapid solidification welding joint of melt-spun Cu-Sn peritectic alloy foils
急冷Cu-Sn合金的快速凝固焊接接头组织特征
18.
Effect of Cu,As and Sn on the low ductility region Ⅲ of low alloy steel continuous casting slabs
Cu、As和Sn对低合金钢连铸坯第Ⅲ脆性区的影响