1.
RZ FLP IS relay signalling unit
RZ型安全火花型继电器信号元件
2.
Voice communications is highly sensitive to delays or irregularities in the transmission of voice signal components.
话音通信是高度敏感的延误或违规传送声音信号元件.
3.
Design and Research on the ECU Signal Hardware Module of ESC System
ESC系统电子控制单元信号模块硬件设计与研究
4.
Wireless Acquisition and Transmission System of Sensing Signals of Smart Cement-Based Sensors
机敏水泥基传感元件信号的无线采集传输系统
5.
send signal element timing circuit
发信信号单元定时电路
6.
The more important safety conditions to be observed in the use of electronic components in railway signaling techniques
GB/T10495-1989铁路信号技术中采用电子元器件时应遵循的主要安全条件
7.
Our main thread waits on an event that is signaled when input is dying.
我们的主线程一直等待输入任务单元结束时产生的事件信号。
8.
glass element, not optically worked for lighting and signalling equipment for cycles and motor vehicles
玻璃元件,未经光学加工,用于摩托车和汽车照明和信号设备
9.
Neuronal Network Signal Process Soft Tool Integration and Analysis of the Correlation Algorithms;
神经元网络信号处理软件包的集成及相关性算法分析
10.
Research on the Software Development Technology and Signal Processing Method of the Vehicle Control Unit;
车载控制单元的软件开发技术和信号处理方法研究
11.
Localization of Ecoding Genes for MLPK and SSP from Brassica Oleracea in Self-incompatibility Signaling Process by FISH
甘蓝自交不亲和性信号传导元件MLPK与SSP编码基因的FISH定位研究
12.
registration of letters, parcels, trunks, etc
信件、 包裹、 衣箱等的挂号
13.
non-modular typeintegral annunciator
非组件式整体信号器
14.
Cloning and Sequence Analysis of THL2 and MOD Encoding Genes Involved in S-receptor Kinase Signal Process and Their Bioinformatical Insight;
S-受体激酶信号传导元件THL2和MOD编码基因的克隆测序及生物信息学初探
15.
Lodgement Document Insurance? Registered Post (Overseas) ? Security Post
挂号信寄件凭证保险?挂号邮件(海外)?保价邮件
16.
glass element, not optically worked for road traffic lights, certain buoys, switchboards or panel lights
玻璃元件,未经光学加工,用于道路交通信号灯、某些浮标、开关板或表盘灯
17.
An infrared detector measures how the heat travels through the tooth while a light sensor picks up the fluorescent signal.
红外线探测器测量热量怎样通过牙齿进行传播，而光敏感元件可以发现荧光信号。
18.
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。