1.
Numerical Methods and Analysis for the Semiconductor Device Simulation with Heat Conduction;
热传导型半导体瞬态问题的数值解法和分析
2.
H~1 ERROR ESTIMATES FOR THE FINITE VOLUME ELEMENT METHOD ALONG CHARACTERISTICS FOR TWO DIMENSIONAL SEMICONDUCTOR DEVICE WITH HEAT CONDUCTION
二维热传导型半导体器件的特征有限体积元方法和H~1模分析
3.
The Heat Transfer Model for a Non-Uniform Granular Flow and It’s Effective Thermal Conductivity;
非均匀颗粒流的热传导模型及其有效热导率
4.
Thermopile-Structured Micro Thermal Conductivity Vacuum Sensor
基于热电堆结构的微型热传导真空传感器
5.
Modeling of Heat Conduction in Thermoplastic Honeycomb Core/Face Sheet Fusion Bonding
热塑性蜂窝面/芯热熔焊接过程中的热传导模型计算(英文)
6.
The transfer matrix across the shrink fit section is established.
本文导出了热套段模型的传递矩阵表达式。
7.
HEAT TRANSFER MODEL FOR DIRECT REDUCTION OF EAF DUST PELLETS
电弧炉粉尘球团直接还原的热传导模型
8.
Two-grid Methods for the Model of 2-D Heat Conduction with Three-temperature;
二维三温辐射热传导模型问题的两层网格方法
9.
Heat Transfer Analysis of Integral Composites Fabricated by Co-injection RTM
共注射RTM成型一体化复合材料的热传导分析
10.
Mathematical model of heat conduction of quenching process and its FEA simulation
淬火热传导数学模型建立及其有限元仿真分析
11.
Lattice Boltzmann method study on the characteristics of thermal transport properties for 1-3 composites
基于Lattice Boltzmann方法的1-3型复合材料热传导特征
12.
Correlation of Conduction Calculation Model for Two Different Cooling Pipes Heat
两种不同水管冷却热传导计算模型相关性探讨
13.
Numerical analysis of laminated ceramic composites by non-Fourier heat conduction
非傅立叶模型层状复合陶瓷结构热传导分析
14.
The ability or power to conduct or transmit heat, electricity, or sound.
传导性传导热、电、或声音的能力或能量
15.
Enterprise Risk Conduction Based on Heat Conduction Principle;
基于热传导原理的企业风险传导研究
16.
(of a substance)allow(heat,electric current,etc)to pass along or through it
（指物质）传导（热、电流等）
17.
not able to conduct heat or electricity or sound.
不能传导热、电或者声音。
18.
thermal conductivity of whiteware ceramics
陶瓷热传导率测定方法