1.
Review of Electromigration Modeling of IC Interconnects
集成电路互连线电迁移建模综述(英文)
2.
On the Applicability of Carbon Nanotubes as Interconnect in Nanoscale Integrated Circuits;
碳纳米管在纳米集成电路互连线中的应用研究
3.
Methodology for Ultra Deep Sub-micro Integrated Circuit Interconnect Geometric Variation Extraction
超深亚微米集成电路互连线几何变异提取方法
4.
Circuits fabricated by inter-connecting smaller circuits or different technologies mounted on a single substrate.
通过将较小型电路互连或采用不同工艺安装在一个基片上而制成的电路。
5.
A Novel Intergrated Circuit Cu Interconnect Process Research;
一种新型集成电路铜互连方法的研究
6.
The Association Connecting Electronics Industries Standardization Work;
美国电子电路与电子互连行业协会标准化工作
7.
Research of Optical Interconnection Waveguides for EOPCB;
光电混合印制电路板（EOPCB）光互连波导研究
8.
Analysis on Electromagnetic Interference of Nonuniform Transmission Lines in High Speed Circuit
高速电路非均匀互连线间电磁干扰分析
9.
Studies on Interconnection Modeling and Timing Optimization for Deep Submicrometer Integrated Circuits;
深亚微米集成电路的互连建模与时序优化
10.
High Speed Front-End Amplifiers Design of Optical Receiver for Optical Interconnect;
用于光互连的高速光接收机前端放大电路设计
11.
Parameter Extracting of Interconnection Line and Via in High-speed Integrate Circuit;
高速集成电路中互连线与Via结构的参数提取
12.
High Speed Front-end Amplifier Design for Optical Receiver of Optical Interconnection
用于高速光互连的光接收机前端放大电路设计
13.
interconnection and connection in electronic equipment
电子设备互连与连接
14.
Pertaining to a line or circuit interconnecting several stations.
用于修饰或说明把若干个站互连起来的通信线路或电路。
15.
Study of Electromagnetic Modeling and Parameters Extraction of On-chip Interconnects in High Speed Integrated Circuits;
高速集成电路片内互连的电磁建模和参数提取研究
16.
Surface Mount Technology and Printed Circuit Board Electrical Interconnection Reliability Research
表面贴装技术（SMT）与印刷电路板（PCB）电器互连可靠性的研究
17.
Interconnection delay has become a dominant factor in IC design.
互连线时延是集成电路设计中非常重要的影响因素。
18.
SSPs are telephone switches, interconnected by SS7 links, that originate, terminate or tandem calls.
SSP 是由 SS7 链路互连的电话交换机，用来发起、终止或汇接呼叫。