1.
Research on MEMS Capacitive Pressure Sensors Based on Flip-Chip Technology;
基于倒装技术的MEMS电容式压力传感器研究
2.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
3.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
4.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
5.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
6.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
7.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
8.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
9.
Hoisting Technique of Inverted Siphon Penstock of Weishui at Baoji Gorge;
宝鸡峡韦水倒虹压力钢管吊装施工技术
10.
a technical knockout
技术击倒((略作 TKO))
11.
Flexible Bumping Technology and Applications in MEMS Flip Chip Packaging;
MEMS器件倒装芯片封装中的柔性化凸点制备技术及其应用
12.
Discussion on Construction Method of Vertical Metal Storage Tank--Upside-down Method by Chain-type Electric Hoists on Each Masts Around
浅述立式金属储罐施工技术——群桅链式电动葫芦起吊倒装法
13.
The technique of reversing, or inverting the normal word order of a sentence.
倒装句：一种将句子正常的表达方法倒置的技巧。
14.
Feign Death: This skill allows an Assassin to fall to the floor and pretend to be dead, only to get up again on his command.
诈死术：这项技能允许刺客倒在地上伪装成死尸，直到收到指令时才起身。
15.
I often hear people say a knockout and a technical knockout.
我经常听人们说击倒对方获胜和技术击倒得胜。
16.
Graphic Simulation Technology for Collapse Response Analysis of Masonry Structures
砌体结构倒塌反应的图形仿真技术
17.
Studies on regulation technology of lodging resistance in high quality edible rice;
优质食用稻抗倒伏调控栽培技术研究
18.
International Environmental Regulations and the Forced Upgrade of Industry Technologies;
国际环境规制与倒逼型产业技术升级