1.
The Research of Ni-SALICIDE Process for the Application to Deep Sub-micron CMOS Devices;
适用于深亚微米CMOS器件的Ni自对准硅化物工艺的研究
2.
advanced polysilicon self aligned process
改进型自对准多晶硅栅工艺
3.
oxide aligned transistor technology
氧化物对准晶体管工艺
4.
silicon gate self aligned junction isolated cmos
硅栅自对准结隔离互补金属氧化物半导体
5.
Study on Fabrication Process of Self-aligned Vertical Comb Actuator Using Silicon Plastic Deformation;
基于硅塑性变形的自对准垂直梳齿驱动器的制作工艺研究
6.
floating gate silicon process
浮栅硅金属氧化物半导体工艺
7.
double poly process
双层多晶硅栅金属氧化物半导体工艺
8.
silicon gate mos process
硅栅金属氧化物半导体工艺
9.
Study of the Technology on Removing Silica, Titanic and Ferric Oxide Impurities from Bauxite
铝矾土除铁、硅、钛氧化物工艺的研究
10.
Experimental Study on Excimer Laser Electrochemical Etching Process of Silicon;
准分子激光电化学刻蚀硅工艺实验研究
11.
sos cmos process
蓝宝石上硅互补金属氧化物半导体工艺
12.
Fabrication and Characterization of Ni-Based Fully Silicided Metal Gate;
Ni基全硅化物金属栅工艺、特性及表征技术研究
13.
Recycle Technology of Byproducts in Methylchlorosilane Manufacture and Interrelated Reaction Macrokinetics;
有机硅单体副产物再资源化工艺及反应动力学
14.
New production technology of barium fluoride and intermediate product barium fluosilicate
氟化钡及中间产物氟硅酸钡生产新工艺
15.
8 Inch Copper Chemical Mechanical Polish Process vs Wafer Corrosion Defect Reduction Method;
八英寸铜化学机械研磨工艺对硅片腐蚀的改善
16.
Effect of Technological Parameters on Microstructure of SiC Particulate Reinforced High Manganese Steel Matrix Composite with Process of V-EPC
工艺条件对高锰钢铸渗碳化硅组织特征的影响
17.
The Effects of Pocessing Parameters on the SiC Whisker Formation in the SiO_2-C-Na_3AlF_6 System
工艺因素对SiO_2-C-Na_3AlF_6系合成碳化硅晶须的影响
18.
Studies the Preparation of Oxide, Polymer Coating Based Silica on AZ91D Magnesium Alloy and Its Corrosion Resistace
AZ91D镁合金表面硅氧化物、高聚物膜层的制备工艺及耐蚀性能研究