1.
Study on SEE characteristic and hardening techniques of CMOS SRAM with sub-micro feature sizes
深亚微米CMOS SRAM SEE特性及加固技术研究
2.
The Substrate Noise Coupling for Deep-submicron CMOS Mixed-Signal ICs;
深亚微米CMOS混合信号电路衬底耦合噪声模型
3.
Study of the GIDL Current and Related Reliability Issues for Ultra-deep Submicron CMOS Devices;
超深亚微米CMOS器件GIDL电流及其可靠性研究
4.
Study on Power Estimation Methodology & Correlative Problem in VDSM Integrated Circuit;
超深亚微米CMOS集成电路功耗估计方法及相关算法研究
5.
The Research of Ni-SALICIDE Process for the Application to Deep Sub-micron CMOS Devices;
适用于深亚微米CMOS器件的Ni自对准硅化物工艺的研究
6.
The High Temperature Application Research of Deep Sub Micron SOI CMOS Circuits;
深亚微米全耗尽SOI CMOS的高温应用分析
7.
Designing Deep Submicron RF CMOS LCVCO with VPCM
利用VPCM设计深亚微米RF CMOS的LCVCO
8.
Nanoscale CMOS Devices Realization with Micron Technology
微米工艺实现纳米级CMOS器件方法及技术研究
9.
Processing continuous submicro/nano SiC fibers by electrospinning
静电纺丝制备连续SiC亚微米/纳米纤维
10.
Our FOXY probes range in thickness from sub-microns to a few microns.
FOXY探测厚度从亚微细粒到几个微米。
11.
Microarc Oxidation Coating of the Sub-Micron Holes
亚微米级孔径微弧氧化膜层工艺研究
12.
Nanometer and Submicron Electrochemical Micromachining Using Ultra-Short Voltage Pulses
纳米、亚微米的超窄脉宽微细电化学加工
13.
The Problems and Methods on VLSI/ASIC Come into Secondary Micrometer and Deep Secondary Micrometer Field;
VLSI/ASIC进入亚微米深亚微米后出现的问题及解决的办法
14.
The hydrated silicon dioxide with three layers structure of micron-submicron-millimicron was observed through TEM.
通过电镜实验,观察到水合二氧化硅具有微米亚微米纳米三次结构。
15.
Micron and Sub-micron CdS Spheres Self-assembled by Low-temperature Hydrothermal Method
低温水热合成由纳米颗粒自组装而成的CdS亚微米和微米球
16.
Research on Property of Metal Based Nano/Submicron Solid Self-lubricating Coating;
金属基纳米/亚微米固体自润滑涂层的性能研究
17.
Domino Logic Circuit Design Based on Submicron Technology
基于深亚微米工艺的多米诺逻辑电路设计
18.
Study on the Influencing Factor of Nano/Submicron Regenerated Silk Fibroin Fibers by Electrospinning
纳米/亚微米再生丝素蛋白纤维制备的影响因素