1.
To match with the spinel, a low temperature frit glass and funnel glass with similar thermal expansion are developed.
分析了封接中材料匹配、浸润性以及再结晶等原理，叙述了封接工艺。
2.
The Research of Photoelectric Cathode Transferred and Sealed Technology of Proximity Focused and Imaged Devices
近贴聚焦成像器件光电阴极传递封接工艺研究
3.
Application of Electrostatic Sealing Technology of Silicon Capacitance Sensor
硅电容传感器中静电封接工艺技术的应用
4.
It is adopted with the advantages of aluminum section structure and self-liquid groove of filter, pleasing appearance and able to endure corrosion.
独特的发泡封接工艺，具有密封界面填充可靠和优良的抗震耐拉性能，结构牢靠。
5.
Influence of the sealing process between the glass and kovar on the bonding propertieswas studied by orthogonal testing method.
采用正交试验方法研究了封接工艺对玻璃与可伐合金结合性能的影响。
6.
Seal Structure and Technique of Broad Band High Power Rectangular Ceramic Hermetic Windows
宽带高功率矩形陶瓷密封窗封接结构及工艺
7.
The Second Metallizing Process of Ceramic to Metal Seal
陶瓷-金属封接中的二次金属化工艺
8.
Research on welding fault during LED chips packaging
LED芯片封装工艺中焊接缺陷研究
9.
Parameters optimization of fillet weld sealing joint in high pressure hydrogenation heat exchange
加氢换热器角焊缝密封接头焊接工艺参数优化
10.
Investigation on FED Sealing and Gas Exhausting Technique;
FED平板显示器件封接及除气工艺的研究
11.
Study on Sealing Process of PAW for Micro-groove Heat Pipe
微沟槽热管等离子弧焊接封口工艺研究
12.
Site Welding Technique and Quality Control Measures of DZL4-100/70-A Ⅱ Boiler Header
DZL4-100/70-A Ⅱ型锅胆封头现场焊接工艺与质量控制措施
13.
Welding Process Test and Application of Bottom Head and Heater Sleeve in Pressurizer
稳压器下封头与加热套管的焊接工艺试验及应用
14.
Comparison between Direct Ammonia Distillation and Indirect Ammonia Distillation
直接蒸氨工艺与间接蒸氨工艺的比较
15.
The machining craft of the main pump components and the method to select mating material are stated in detail as well.
同时对泥浆泵过流部件的制造工艺、封接合面材料的选取作了详细说明。
16.
New manufacture processes and new glass forming systems will play a great part in the development of low-temperature seal glass.
新的制备工艺和新的玻璃形成体系将对封接玻璃发展起着十分重要的作用。
17.
The PQR shall include the composition and flow rate of the shielding and inert gas backing, when used.
焊接工艺评定记录单上应包括封底焊时所用的惰性保护气体组成成分和流率。
18.
Technology for End-coating Chip Resistors and the Structure and Principle of the End-coating Machine
片式电阻器封端工艺及封端机的结构原理