1.
Research on the Package of Humidity Sensor Compatible with CMOS Technology;
CMOS兼容湿度传感器封装的研究
2.
Packing Technology of High Temperature Pressure Transducer
MEMS耐高温压力传感器封装工艺
3.
Study on pressure sensing technology of a compensable fiber grating
光纤光栅高压传感器封装技术实验研究
4.
Structural Analysis and Tests of Encapsulation Shell of Fiber Bragg Grating Hydraulic Seepage Sensor
光纤光栅水工渗压传感器封装的结构分析与试验
5.
Research on FBG Sensor Package Technology，Temperature and Strain Separation Method;
光纤布拉格光栅传感器封装与应变/温度分离技术
6.
Influences of the Packaging Structure of Platinum Resistance Temperature Sensor on Response Time
铂电阻温度传感器封装结构影响响应时间的因素
7.
Study on CFRP Encapsulating Fiber Bragg Grating Sensor;
碳纤维复合材料封装FBG传感器研究
8.
Thick Film Integration Package Technology for Pressure Sensor
压力传感器的厚膜混合集成封装技术
9.
Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor
采用芯片直接安装技术封装的风速风向传感器
10.
safe sensor with seal for wire end
接线端具有封印保护装置的安全传感器
11.
Research of Demodulation and Packaging Tecknics on Fiber Grating Sensors;
光纤光栅传感器解调技术及封装工艺的研究
12.
The Fiber Bragg Grating and the Sensing Study on the Sensor Encapsulated by the Alloyed Steel;
光纤Bragg光栅及其合金钢封装传感器特性研究
13.
Study on System-in-Package Technology of MEMS Air Pressure Sensor;
MEMS气体压力传感器的系统级封装（SiP）技术研究
14.
Design of High-pressure Packing Seal for Pressure Sensor Calibration Device
压力传感器标定装置高压密封垫的设计
15.
Fiber Bragg Grating Temperature Sensor without the External Stress Encapsulation
无外应力封装的光纤Bragg光栅温度传感器
16.
Research on Encapsulation Technique of FBG Strain Sensor Under High Strain Working Condition
高应力状态下FBG应变传感器的封装研究
17.
Enhancing-sensitivity packaging technique and experimental study for fiber Bragg grating temperature sensor
FBG温度传感器增敏封装技术及实验研究
18.
Packaging technique of enhancing temperature-sensitivity for fiber bragg grating sensor
光纤布拉格光栅(FBG)温度传感器增敏封装技术