1.
Researches on Electrical and Mechanical Characteristics of Low Temperature InP/Si Wafer Bonding;
InP/Si低温晶片键合的电特性和力学特性的研究
2.
Experiments of Low Temperature Wafer Bonding and Analysis on Relevant Dynamics;
低温晶片键合的实验和动力学特性研究
3.
Investigation of Low-Temperature Wafer Bonding and Long-Wavelength Tunable Integrated Optical Demultiplexing and Receiving Device for WDM Application;
低温晶片键合技术及长波长可调谐WDM解复用光接收集成器件的研究
4.
Theory Analysis and Experiment Research of Low Temperature Si/InP Wafer Bonding Technology;
Si/InP晶片低温键合技术的理论分析和实验研究
5.
Mechanism and Process of Cu-Sn Bonding for Wafer Level MEMS Packaging
MEMS圆片级封装用Cu-Sn低温键合机理与工艺研究
6.
The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.
在硅／玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。
7.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
8.
Research of GaAs/InP Wafer Bonding Technology;
GaAs/InP晶片键合技术的研究
9.
Spinal and Spinel-zirconia Composite Material Prepared at Low Temperature by Al_(13) as Aluminium Source
Al_(13)低温合成尖晶石和尖晶石-氧化锆复合材料
10.
Low Temperature Synthesis of TiC\TiN\TiCN Nanaocrystallites Via Chemical Metathesis Route;
化学交换法低温合成TiC\TiN\TiCN纳米晶体
11.
Preparation of SiC Whiskers by Low-temperature Decomposition of Silicon Nitride
氮化硅低温转化合成碳化硅晶须研究
12.
Synthesis of PcBN compacts with low cBN content under high pressure and high temperature
低含量PcBN复合片在高温高压下的合成
13.
LOW CYCLE FATIGUE BEHAVIORS AND MICROSTRUCTURES OF Ti-2Al-2.5Zr WITH FINE GRAIN AT RT AND 77K
细晶Ti-2A1-2.5zr合金室温/低温低周疲劳行为及微观结构
14.
The Investigation of Grain Refining Process for Ni-Base Superalloy Blade Surface;
高温合金叶片表面晶粒细化新工艺的研究
15.
Microstructure and Properties of the Third Generation Low-cost Single Crystal Nickel-Base Superalloy;
低成本第三代单晶高温合金的组织与性能
16.
Structure Characterization of Mesoporous Titania Wiskers and Studies on the Mechanism of Low-temperature Synthesis;
介孔氧化钛晶须结构表征及低温合成机理研究
17.
In this paper, the crystallization mechanism of synthesizing nanocrystal titanic in liquid media at low temperature is reviewed in detail.
详细介绍了晶态纳米二氧化钛低温液相合成的晶化机制。
18.
Study on Low Temperature Glass Frit Bonding for MEMS Device
MEMS器件封装的低温玻璃浆料键合工艺研究