1.
A Study of the Bonding Reliability for the Anisotropic Conductive Adhesive Film;
各向异性导电胶膜粘接可靠性的研究
2.
A Study of Interconnection Reliability for Low-temperature Sintered Nano-silver Paste;
纳米银焊膏低温烧结粘接可靠性研究
3.
Investigation of Characteristics for Adhesive and Bonding Reliability for COG Assembly under Hygrothermal Conditions;
高温高湿环境下粘结剂性能和COG粘接可靠性的研究
4.
The Analysis of Reliability for the Reinforced Concrete Beams Strengthened with Steel Plates;
粘钢加固钢筋混凝土梁的可靠性分析
5.
Primary Exploration on the OCS System Reliability and Study on Contact Line Reliability;
接触网系统可靠性初探及接触线可靠度研究
6.
Suggests the prop-er bond method should be chosen upon con ditions of wa- terproofing works to increase seal reliability of the laps.
建议根据防水工程特点,选用不同的粘贴方法,提高卷材与卷材接合部位的密封可靠性。
7.
Reiable operation, no coal adhering and blockage. Good adaptability to various coal powder.
性能稳定可靠，不结粘、不堵粉，对煤粉适应性强。
8.
Structural Reliability Analysis for Viscoelastic Materials of Solid Propellant;
固体推进剂类粘弹性材料结构可靠性分析
9.
Optimization of Reliability and Optimum Design in Consideration of Reliability for Tapered Interference Articulation;
圆锥面过盈联接可靠度优化和可靠性优化设计
10.
Structure Dynamic Reliability Analysis of Solid Rocket Motor Viscoelasticity Grains;
固体火箭发动机粘弹性药柱的动态可靠度分析
11.
The Experiment Study on Bonded Anchor Behavior of Planted Bar and Reliability Analysis;
植筋粘结锚固性能的试验研究及可靠度分析
12.
Analysis on Reliability and Contact Bonding for Sealed Electromagnetic Relay;
密封电磁继电器的可靠性及触点粘结失效分析
13.
Effects of Voids on Thermal Reliability in Power Chip Die Attachment Solder Layer
空洞对功率芯片粘贴焊层热可靠性影响的分析
14.
The liner, which has special propertie s of good anti-migration and reliable adhesion, is also discussed in the paper.
研制的聚氨酯衬层具有抗迁移能力强，粘接可靠的特点。
15.
Acceptance and reliability for discrete semiconductor devices
GB/T4938-1985半导体分立器件接收和可靠性
16.
Improvement of IMP S-Net Interface Communication
IMP s-网络接口通信可靠性的改进
17.
It directly affects unit reliability and availability.
它直接影响到机组的可靠性和利用率。
18.
Reliability Evaluation of the Interference Fits Based on Mea-surement Data
基于实测数据的过盈联接可靠性评定