1.
BGA Assembly Technology Research for Solder Ball's Reliability
对BGA封装技术中锡球焊接可靠性的研究
2.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
3.
Solder Joint Fatigue Life Predicton with Submodel for a BGA Package;
子模型法预测BGA封装中焊点的热疲劳寿命
4.
Analysis on Mechanical Behavior of BGA Solder Joints under Shock Loading;
冲击载荷下BGA封装焊点的力学特性研究
5.
Analysis on Thermal Stress and Thermal Reliability of BGA Packaging
BGA封装的热应力分析及其热可靠性研究
6.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
7.
Application of ESPI in Solder Ball Failure Test on Board-Level BGA Package
ESPI在板级BGA封装器件焊球失效检测中的应用
8.
The Technology of the Detection for Defects in BGA Package Based on Flat Panel Detector
基于平板探测器的BGA缺陷检测技术
9.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
10.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究
11.
Defects Inspection and MATLAB Simulation of Chips BGA Packages Based on Machine Vision
基于机器视觉的芯片BGA封装焊球缺陷检测及MATLAB仿真
12.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
13.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
14.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
15.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
16.
Research and Design of MPEG-4 Encapsulation Method Based on RTP;
基于RTP的MPEG-4封装技术研究与设计
17.
Research on RF MEMS Switch Packaging;
RF MEMS开关封装技术的研究
18.
DLL Packaging Technique in MIS Foreground Application Development;
MIS前台应用开发中的DLL封装技术