1.
A double solid resin junction reference electrode has been developed.
研究了一种双固体树脂接界的参比电极。
2.
Research on Low Viscosity Bisphenol F Epoxy Curing System;
低粘度双酚F环氧树脂固化体系的研究
3.
The Curing System of Epoxy Resin/Dicyandiamide Toughed by Chain-extended Urea Containing HTPB
含HTPB的扩链脲改性环氧树脂/双氰双胺固化体系反应活性研究
4.
Synthesis of Liquid Bisphenol a Epoxy Resin and Curing Behavior and Performance of a Novel Epoxy Resin
双酚A型液体环氧树脂的合成及特种环氧树脂的固化行为与性能的研究
5.
STUDY ON THE PROPERTIES OF CURED COMPOUND IN BDMA/DICY/EP SYSTEM
苄基二甲胺/双氰胺/环氧树脂体系固化物性能的研究
6.
The Curing Reaction and Thermal Properties of the Blends of Benzoxazine and Epoxy
双酚A型苯并噁嗪与酚醛型环氧树脂共混体系的固化反应与热性能
7.
Chemo-rheological model of low temperature curing bisphenol-F epoxy resin system
低温固化双酚F型环氧树脂体系的化学流变模型
8.
Study on ELPB adhesive cured by PMDA and BPO double curing agents
含BPO/PMDA双固化剂体系聚丁二烯环氧树脂胶粘剂的研究
9.
y two-arm resin sand mixing unit
固定式双臂树脂砂混砂装置
10.
Study on curing reaction kinetics of low temperature curable BMI modified by PES
PES改性低温固化双马树脂固化动力学研究
11.
Application of glassfiber post and dual-cure composite cement on reattachment of crown fractured permanent incisors
玻璃纤维桩与双固化树脂型水门汀在外伤恒前牙冠折牙再接术中的应用
12.
Shear Bond Strength of Resin Brackets Bonded to Porcelain and Light-cured Composite Resin;
树脂托槽与瓷、光固化复合树脂粘接抗剪切强度的实验研究
13.
Birefringence of the cured resin was measured with a senarmont compensator.
用塞拿蒙补偿器测定固化树脂的双折射率。
14.
Study on the Curing of Biphenol-A Epoxy Resin under Microwave Conditions;
微波作用下双酚-A型环氧树脂固化行为的研究
15.
Curing Reaction and Property Investigation of New Aromatic Bismaleimide
新型芳香族双马来酰亚胺树脂固化反应及性能
16.
Study on room temperature curable two component epoxy resin structural adhesive
室温固化双组分环氧树脂结构胶的研究
17.
resin-solvent-curing agent
树脂-溶剂-固化剂
18.
a white crystalline solid occurring in many resins.
一种白色晶状固体，见于许多树脂中。