1.
Temperature distribution of Al/Ti dissimilar alloys joint in laser welding-brazing
铝/钛异种合金激光熔钎焊接头温度分布
2.
Microstructure and properties of dissimilar metals TIG welding-brazing joint of aluminum alloy to stainless steel using Al-Si flux-cored wire
铝合金与不锈钢异种金属铝硅药芯焊丝TIG熔钎焊接头组织及性能
3.
Characteristics of precoating TIG welding-brazing joint of aluminum alloy to stainless steel
铝合金/不锈钢预涂层钨极氩弧熔钎焊接头的特性
4.
Laser Welding-Brazing Process and Microstructure Property of Al/Ti Joint;
Al/Ti异种合金的激光熔钎焊工艺及接头组织性能研究
5.
MICROSTRUCTURE ANALYSIS OF INTERFACIAL LAYER WITH TUNGSTEN INERT GAS WELDING-BRAZING JOINT OF ALUMINUM ALLOY/STAINLESS STEEL
铝合金/不锈钢钨极氩弧熔-钎焊接头界面层的微观结构分析
6.
Bonding process of pure copper with amorphous Cu-P interlayer
非晶Cu-P钎料钎焊接头形成过程
7.
Affect of Different Solder on Intension of Cu/W Brazing Joint
不同焊料对Cu/W钎焊接头强度的影响
8.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
9.
Effect of Cr on Property of Stainless Steel Joint Brazed with Series Ni-P Filler Metal
Cr对Ni-P系钎料钎焊不锈钢接头性能的影响
10.
Microstructure and Mechanical Property of Joint by Amorphous Fillers
非晶镍基钎料钎焊接头性能及微观组织的研究
11.
Microstructure of Soldering Joint of Rapidly Solidified Sn2.5Ag0.7Cu Solder Alloy
快速凝固态Sn2.5Ag0.7Cu钎料钎焊接头的显微组织
12.
Study on Soldering Procedure and Joint Properties of Down Quenching SnAgCu Solder Alloy
急冷型SnAgCu系钎料合金钎焊工艺及接头性能研究
13.
Microstructure and Properties of Vacuum Brazing C_f/C Composites Using Reactive Al Based Filler Metals
铝基活性钎料真空钎焊C_f/C复合材料焊接接头的组织及性能
14.
Research on Technology and Mechanism of Laser Welding-Brazing for Ti/Al Dissimilar Alloys
Ti/Al异种合金激光熔钎焊工艺与连接机理
15.
Phase Constitution of Soldering Seam and Mechanical Properties of Zn Matrix Filler Metal Soldering Magnesium Alloy AZ31B Joint
Zn基钎料钎焊镁合金AZ31B接头的钎缝物相及力学性能
16.
Study on the Creep Behavior of SnAgCuRE Solder Joints;
SnAgCuRE钎焊接头蠕变行为的研究
17.
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
18.
Structure of brazed joints of TA2/BT20 with Ag-28Cu filler metal
Ag-28Cu钎焊TA2/BT20接头组织分析