1.
Every pack of powder is back-filled with inert gas to prevent further oxidation during storage.
惰性气体的运用防止了在贮藏时每一包焊锡粉的进一步氧化。
2.
Powder produced in this way has a uniform particle size distribution, low oxide content and high purity.
这种方法制造出来的焊锡粉具统一的粒径、氧化和高纯度的特性。
3.
Effect of inner diameter of delivery tube end of atomizer on morphology and size distribution of free-lead solder powder
雾化器导液管内径对无铅焊锡粉末形貌及粒度分布的影响
4.
All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.
我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。
5.
It involves the considerations of alloy content, tin powder particle and soldering flux type.
选择锡膏要考虑的因素包括合金含量，锡粉颗粒和助焊剂的因型。
6.
No white power occurring on soldered surface or surface of the components, no moisture absorption.
焊锡表面和零件面无白粉产生、无吸湿性。
7.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
8.
Study on Supersonic Atomization Theory and Production of Solder Alloy Fine Powder;
焊锡微粉的超音速雾化原理及制备工艺的研究
9.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
10.
tin-lead 60-40 solder
锡铅60-40焊料
11.
Apart from pre-treatment products: powder paint, stripped from agents and removing wax water, antirust oil; Electronics and solder flux.
烤漆前处理产品：除油粉、漆剂、油除蜡水、锈油等；电子、锡助焊剂。
12.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
13.
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
14.
Asahi Metals (HK) Ltd.
朝日焊锡制品有限公司
15.
Sterling aluminium solder
斯特林锡锌铝合金焊料
16.
We fused the pipes with solders.
我们用焊锡熔接管子。
17.
Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.
下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。
18.
tinning the ends of the wires makes a better joint when you solder them.
当你焊接接口时，用锡焊很管用。