1.
Chemical Imidization of Polyamic Acid Film Modified with Gelatin
明胶改性聚酰胺酸薄膜的化学亚胺化
2.
Kinetic Study of the Thermal Imidization for Poly(amic acid) Film
聚酰胺酸薄膜表面热亚胺化动力学研究
3.
Preparation and Characterization of Nitrile-Containing Polyimides and Their Barium Titanate Composite Films;
含腈聚酰亚胺及其钛酸钡复合薄膜的制备与表征
4.
Fabrication and Dielectric Characterization of Advanced BaTiO_3/Polyimide Nanocomposite Films;
钛酸钡/聚酰亚胺纳米复合薄膜的制备与性能研究
5.
The Dielectric Characteristic Research of Nano-Composite Polyimide Film;
纳米复合聚酰亚胺薄膜的介电性研究
6.
Preparation and Characterization of Polyimide/SiO_2-TiO_2 Hybrid Film;
聚酰亚胺/SiO_2-TiO_2杂化薄膜的制备与表征
7.
Study of Inorganic Nano-Particles/Polyimide Hybrid Film;
无机纳米/聚酰亚胺杂化薄膜的研制
8.
The Electric Characteristic Research of Inorganic Hybrid Polyimide Film;
无机杂化聚酰亚胺薄膜的电性能研究
9.
Study on the PI/Nano-Al_2O_3 Three-layer Composite Films
聚酰亚胺/纳米Al_2O_3三层复合薄膜的研究
10.
Research of Performances of m-PASSA Film
间位聚芳硫醚砜酰胺薄膜性能的研究
11.
Preparation of Polythioetherimide Films and Study on the Properties
聚硫醚酰亚胺薄膜的制备与性能研究
12.
Preparation of three-layer polyimide/nano-alumina composite films
聚酰亚胺/纳米Al_2O_3三层复合薄膜的制备
13.
Preparation of Polyaryletherketone Polyimide Films and Study of Their Properties;
聚芳醚酮型聚酰亚胺薄膜的制备及其性能研究
14.
Morphology of pPDA/ODA-PMDA Block Copolymer
pPDA/ODA-PMDA嵌段共聚酰亚胺薄膜的聚集态结构
15.
Adhesive coated polyimide film for flexible printed circuits
GB/T14709-1993挠性印制电路用涂胶聚酰亚胺薄膜
16.
Flexible copper-clad polyimide film for printed circuits
GB/T13555-1992印制电路用挠性覆铜箔聚酰亚胺薄膜
17.
Characteristics of electrical breakdown for MMT/PI hybrid films
蒙脱土/聚酰亚胺复合薄膜的电击穿破坏特性
18.
Preparation and Properties of Silicon-Containing Polyimides and Their Composite Films;
含硅聚酰亚胺及其复合薄膜的制备与性能