1.
Study of Polymer Surface Hydroxylation and Its Applications on Chemical Bond Assembly and Biology Functionalization;
聚合物表面羟基化及其在化学键组装和生物功能化方面的研究
2.
Covalent Immobilization of Nile Blue on Self-assembled Thiol-monolayer Modified Gold Electrodes and Its Electrocatalytic Characteristics;
耐尔蓝共价键合固定于自组装膜电极表面的电化学特性
3.
Coordination Interaction and Hydrogen-Bonded Driving Supramolecular Complexes and Controllable Self-Assembly Reaction of Bimetallic Macrorings;
以配位键和氢键驱动的超分子及双金属大环的可控性自组装化学研究
4.
Key Technologies and Quality Controls for the Field-Assembly of a Large-Sized Gasifier;
大型气化炉现场组装技术关键及质量控制
5.
Chemical bond mainly includes electrovalent bonds, covalent bonds, and metalic bonds.
化学键主要有离子键、共价键、金属键。
6.
The Design and Assembly of Molecular-Based and Layered Lanthanide Silicate Hybrid Luminescent Materials;
分子型及插层强键稀土杂化发光材料的设计组装
7.
Hydrogen-Bonded Self-assembling Supramolecular Poly(Isobutylene-co-p-methylstyrene-co-p-bromomethylstyrene);
氢键自组装溴化异丁烯—对甲基苯乙烯共聚物弹性体的制备
8.
Optimal Design on Key Components of Thermal Cycling System of Coating Line
涂装生产线热循环系统关键组件的优化设计方法研究
9.
Molecular Dynamics Simulation on Structure, Hydrogen-Bond and Hydration Properties of Diflunisal Intercalated Layered Double Hydroxides
二氟尼柳/水滑石插层组装结构、氢键及水合特性的分子动力学模拟
10.
Panel on the construction of installations for the chemical industries
建筑化学工业装置问题小组
11.
Bottom-up fabrication of hierarchical ZnO nanostructures by chemical epitaxial growth
化学溶液法外延组装ZnO分级纳米结构
12.
Study on Electroless Deposition NiMoP Layer by SAM
自组装方法化学沉积NiMoP镀层研究
13.
ELECTROCHEMICAL CHARACTERIZATION OF SELF-ASSEMBLED MONOLAYERS ON IRON SURFACE BY SECM
扫描电化学显微镜对铁自组装膜的电化学表征
14.
Layer-by-Layer Assembly of Polymers via Hydrogen Bonding or Halogen Bonding: Effect of Solvents;
基于卤键或氢键的聚合物层状组装：溶剂影响
15.
Production Processes and Electrochemical Properties of Soft-Packed Lithium-Ion Batteries;
软包装锂离子动力电池关键工艺及电化学性能研究
16.
Be responsible for executing the cyclic examination flow for key unit in plant.
负责执行装置关键机组循环检查流程。
17.
The Key Equipment Research for Automobile Cluster and Monitor;
轿车显示器与组合仪表关键装备研究
18.
L7 Keypad Board Test System Develop;
L7手机键盘板组装件测试系统设计