1.
Thermodynamics Cycle Mode Analysis of Thermoacoustic Engine and Design for Miniaturization Thermoacoustic Refrigerator;
热声热机热力学循环模型分析与微小型热声制冷机设计
2.
The Born-Haber cycle is a thermodynamic cycle that shows the interrelation of these quantities.
波恩-哈伯循环是一个热力学循环，表示了这些量之间的关系。
3.
The Thermodynamic Analysis of a Quantum Ericsson Cycle Performance
量子埃里克森循环性能的热力学分析
4.
A THERMODYNAMIC OPTIMIZATION OF CLOSED-CYCLE BRAYTON PLANTS FOR AEROSPACE POWER SYSTEM
航空航天用闭式布雷顿循环的热力学优化
5.
Finite Time Thermodynamic Optimization for Irreversible Closed Brayton Power Cycles
不可逆闭式布雷顿循环有限时间热力学最优化
6.
THERMODYNAMIC INVESTIGATION OF NEW NUCLEAR ENERGY BRAYTON CLOSED-CYCLE
新一代核能布雷顿闭式循环热力学分析研究
7.
Finite Thermodynamic Analysis for Air Standard Otto Cycles
空气标准奥托循环的有限时间热力学分析
8.
Novel Thermodynamic Cycle with Cascade Utilization of Chemical Exergy and Physical Exergy of Fossil Fuel;
燃料化学能与物理能综合梯级利用的热力循环
9.
Chemical Diagnosis and Auto-control Based on Water Quality Parameters for Thermodynamic Cycle System;
循环热力系统水质化学诊断与参数自动控制
10.
Thermodynamic Properties and Performances in Refrigeration and Air-conditioning Cycles of CF_3I;
CF_3I的热力学性质与制冷、空调循环性能研究
11.
Finite Time Thermodynamic Analysis and Optimization of Brayton Cogeneration Cycle;
Brayton联产循环有限时间热力学分析与优化
12.
Thermodynamic anslysis of combined power and refrigerating cycle for power plant air cooling system
复合制冷循环电站空冷系统的热力学分析
13.
FINITE TIME THERMODYNAMIC CHARACTERISTIES OF A REGENERATED BRAYTON REFRIGERATION CYCLE
一类回热式布雷顿制冷循环的有限时间热力学性能
14.
A Pneumatic-Thermal Expansion Type Cycling Method for Solar Cooling & Heating and Power Generating
可使用太阳能制冷(热)和发电的热力循环技术——气压-热力膨胀式循环
15.
Studies on the Propelling Force and Heat Exchanging of the Spontaneously Circular Evaporator;
自然循环蒸发器循环推动力及传热研究
16.
open-cycle magnetohydrodynamics
开式循环磁流体动力学
17.
Analytical Expressions of the Finite-time Thermodynamic Performance for Irreversible Closed Brayton Power Cycle
不可逆闭式布雷顿循环有限时间热力学性能的解析公式
18.
Experimental Research on Solder's High Temperature Mechanical Property and Thermal Cycle Numeric Simulation of Solder Joints in Electronic Package;
电子封装焊料高温力学性能实验及焊点热循环数值模拟研究