1.
Development of Electroless Gold Plating Bath IG-600 for PCBs
电路板化学镀金液IG-600的研制
2.
The Research on the Corrosion of Plating Bath and the Processes of Electroless Plating Nickel and Electroplating Zinc on Magnesium Alloy;
镁合金镀液腐蚀与镀镍镀锌的工艺研究
3.
Silver-antimony Alloy Coating and Antimony Content Analysis;
银-锑合金镀层及镀液中锑含量分析
4.
High-speed Determine of Gold in Gold-plated Solution and Exhausted Wash Liquid
镀金溶液与漂洗废液中金的快速测定
5.
A Study of Solution Stability of Ni-P-Diamond Electroless Composite Coating on Magnesium Alloy
镁合金化学镀Ni-P-金刚石镀液稳定性的研究
6.
Zinc base die castings are always copper plated in cyanide baths.
锌基合金的压铸件总是在氰化镀液中镀铜。
7.
The Research on Electroless Nickel Plating Process of Magnesium Alloy AZ91D in Nickel Sulfate Bath;
AZ91D镁合金在硫酸镍镀液中化学镀镍工艺的研究
8.
Ageing and Regeneration on Solution of Electroless Plating Composite Ni-P-Diamond
化学镀镍-磷—金刚石镀液的老化与再生研究
9.
Effects of alloying elements in the dipping solution on the interface structure of hot dip aluminized steel
镀液合金元素对钢镀铝界面组织的影响
10.
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
11.
Study on Direct Electroless Ni-P Alloy Plating on Magnesium Alloy into Neutral Plating Bath and Properties of Plating Layer;
镁合金在中性镀液中直接化学镀Ni-P工艺及镀层性能的研究
12.
Effects of NiSO_4 content in plating bath on the quality of Ni-W alloy coating
镀液中硫酸镍浓度对镍钨合金镀层电镀质量的影响
13.
Effect of Ni/Zn Ratio in Plating Solution on Zn-Ni Electroplating of Acidic Liquid
镀液中镍锌含量比对酸性液电镀Zn-Ni合金的影响
14.
A Study on Stability of Electroless Ni-P Solution;
Ni-P合金化学镀溶液的稳定性研究
15.
Investigation of Zinc Dross in Hot Dip Zn-Ni Alloy Bath at 435 ℃
435℃热浸锌镍合金镀液中锌渣的研究
16.
Determination of Copper(Ⅱ) and Nickel(Ⅱ) in Cu-Ni Alloy Plating Bath
铜-镍合金镀液中铜(Ⅱ)和镍(Ⅱ)的测定
17.
Spectrophotometric determination of cobalt in tin–cobalt alloy plating solution with picramazochrom
分光光度法测定锡钴合金镀液中的钴
18.
Determination of Tungsten in Ni-W-P Alloy Electroplating Solution
Ni-W-P合金电镀液中钨的测定