1.
Si_3N_4/Inconel600 Partial Liquid Phase Diffusion Bonding;
Si_3N_4/Inconel600部分液相扩散连接研究
2.
Contrast analysis of 10Cr9Mo1VNb steel pipe transient liquid-phase bonding and TIG+SMAW
10Cr9Mo1VNb钢管的瞬时液相扩散连接与TIG+SMAW焊对比分析
3.
Effects of Intelayer Composition on Transient Liquid Phase Bonding Process
中间层成分对瞬时液相扩散连接过程的影响
4.
Investigation of Transient Liquid Phase Bonding for 12Cr1MoV/TP304H Heterogeneity Steel Pipes;
12Cr1MoV/TP304H异种管材的瞬时液相扩散连接
5.
Influence of Bonding Temperature on Microstructure and Property of T91/102 TLP Joint
连接温度对T91/102异种钢管瞬时液相扩散连接接头组织性能的影响
6.
Transient Liquid Diffusion Bonding Process of Pearlite Heat-resistant Steel 12Cr1MoV
珠光体耐热钢12Cr1MoV的瞬时液相扩散连接工艺
7.
Effect of Holding Time on TLP Bonding of 20 Steel Pipes
保温时间对20钢管道瞬时液相扩散连接的影响
8.
Reserch on Nonplanar Interfaces Formed by Transient Liquid Phase Diffusion Bonding Process
瞬时液相扩散连接非平面结合界面的研究现状
9.
Applications of transient liquid-phase bonding in nickel and nickel-base alloy welding
瞬时液相扩散连接在镍及镍基合金焊接中的应用
10.
Microstructure and mechanical property of transient liquid phase bonded aluminum silicon alloy joint
Al-Si合金瞬间液相扩散连接接头组织与力学性能
11.
Study on Technology and Mechanism of Removing Oxide Film during Vacuum-Free Vibration Liquid Phase Diffusion Bonding of SiCp/ZL101A Composites;
SiCp/ZL101A非真空振动液相扩散连接下氧化膜去除工艺及机理研究
12.
Process and Microstructure Properties of Welding GH3128 with TLP Technology;
GH3128镍基高温合金液相扩散连接工艺及组织性能研究
13.
Joint Interface and Strengthen of Transient Liquid Phase Bonding for Heat-Resistance Steel;
耐热钢瞬时液相扩散连接界面结构与强化机制研究
14.
The Key Parameters of the Transient Liquid Phase Diffusion Bonding Process and Selection Principle
瞬时液相扩散连接过程中的关键参数及其选用原则
15.
Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints
TC4/Cu/ZQSn10-2-3扩散连接接头微观分析
16.
Diffusion bonding using powders with a high-content of 2223 phase for superconducting Bi-based tapes
高2223相含量粉末扩散连接BSCCO带材
17.
Study on the microstructure of transint liquid phase diffusion bonding joint of 16Mn steel
16Mn钢的瞬间液相扩散焊接头微观组织
18.
Numerical Simulation of Double Partial Transient Liquid Phase Bonding in Si_3N_4 Ceramic;
Si_3N_4陶瓷二次部分瞬间液相连接数值模拟