1.
Electrifying-electrodes Assisted Thermal Bonding Method and Fabrication of Multi-metal Microelectrodes Integrated on the Single Substrate
电极通电辅助热键合与多种金属微电极的单片集成
2.
Hydrothermal synthesis and structural characterization of one novel cuprum imidazole complexes having hydrogen-bonded frameworks
水热合成具有氢键网络的铜咪唑化合物(英文)
3.
glucosidic linkage
糖苷键[合],苷键[合]
4.
Power Bond Graph Theory Study and Its Application in Thermal System;
功率键合图理论及其在热工对象上的应用研究
5.
Impact of the chip bonding layer material on the thermal resistance of power LED
芯片键合层材料对功率型LED热阻的影响
6.
Research on Nonlinear Vibration of Contact Interface in Thermosonic Bonding Transducer System
热超声键合换能系统接触界面非线性振动研究
7.
Stress Damage on Vertical Structure GaN-Based LEDs
垂直结构GaN基LEDs热压键合应力损伤分析
8.
Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响
9.
Effects of Annealing and Drawing on Properties of Single Crystal Copper Bonding Wire
冷变形和热处理对单晶Cu键合丝性能影响
10.
Research of Key Technologies of Thermal Conductive Composite Compact Plate-Shell Heat Exchanger;
导热复合材料紧凑型板壳式换热器关键技术研究
11.
Melamine phosphate is the key material to guarantee the comprehensive performances for insulting layer.
三聚氰胺磷酸盐是保障绝热层综合性能的关键材料。
12.
Studies on Vibration Propagation and Performance Formation of Thermosonic Flip Chip Bonding Interface;
热超声倒装键合界面运动与界面性能的生成规律研究
13.
The Integration and Optimization of Heat Exchanger Networks and Key Technology Research of Equipment s Characteristic Parameter;
换热网络综合优化及设备特征参数的关键技术研究
14.
Research on Hot Embossing and Bonding for Fabrication of Plastic Microfluidic Chips;
塑料微流控芯片微通道热压成形及键合工艺研究
15.
Electrical/Thermal Properties and Crystallization Kinetics of RAS Glass-ceramics for Anodic Bonding
阳极键合用RAS系微晶玻璃电学/热学性能及其析晶动力学研究
16.
Research of Multi-Pass Plate Hot Rolling by Mathematic Model
中厚板热轧综合解析数值法建模的几个关键问题研究
17.
THE KEY TECHNIQUES FOR CALCULATION OF THE SOLID-ELASTIC STRESS FIELD WITH THE FINITE DIFFERENCE METHOD
应用有限差分进行涡轮气热弹耦合计算关键性问题的研究
18.
Please fix hotkey then:
请牢记您的“热键”目前是：