1.
Constitution Reaction of Si-Si bond by Low-vlent Titanium Agent: Synthesis of Functional Polysilane
低价钛试剂促进的硅硅键的构造反应:官能化聚硅烷的合成
2.
A Si-Si Bonding Sandwich Accelerometer with Precisely Controllable Capacitor Gap;
一种电容间隙精确可控的硅硅键合三明治加速度传感器
3.
The pertinent siloxane compounds contain two silicon hydride bonds.
所说的硅氧烷组合物中，含有两类硅氧键。
4.
Electrical Steel Sheet
电器用硅 [硅] 钢片
5.
Fine aluminum-1% silicon wire for semiconductor lend-bonding
GB/T8646-1998半导体键合铝--1%硅细丝
6.
Research the Key Technology of Silicon Wafer's Grinding Device Based on Silicon Wafer Rotating;
硅片自旋磨削试验台关键技术的研究
7.
Research on Key Technologies of Polysilicon Source and Drain SiC N Channel MOSFET;
多晶硅源漏SiC N-MOSFET关键技术研究
8.
High Temperature Model and the Key Processes of SiC MOSFET;
碳化硅MOSFET的高温模型及关键工艺研究
9.
On-Line Examination Method of Bonding Strength Measurement in Silicon MEMS Devices
硅MEMS器件键合强度在线检测方法
10.
Critical Hydrolytic Technological Parameters of Vinyltriethoxysilane
乙烯基三乙氧基硅烷(VS)水解关键工艺
11.
Synthesis and application of hydrogen-bond acidic grafted polymers
氢键酸性接枝聚硅氧烷的合成及应用
12.
Influence of Silicon/Glass-ceramic Anodic Bonding Technology on Bonding Intensity
硅/微晶玻璃阳极键合工艺对键合强度的影响
13.
Composite Polymer Electrolyte of Polysilaether Containing Moiety Si-H Bonds in the Side Chain and Polyethylene Oxide Ⅰ.Ionic Conductivity Study
含硅氢键聚二硅氧烷/聚醚共混聚合物电解质 Ⅰ.离子电导率研究
14.
Microstructure and mechanisms of the interface between borosilicate glass and silicon by anodic bonding
硼硅玻璃与硅阳极键合机理及其界面微观结构分析
15.
Several macroporous silicas were bonded with C?4, C?8 and C??18? alkyl dimethyl monochlorosilianes. These alkyl-bonded phases were suitable for the separation of proteins.
采用大孔硅胶和一氯硅烷制备了几种用于蛋白质分离的大孔硅胶短链烷基键合固定相。
16.
The Preparation of Silica-Based Anton-Ex-change Packings with Quaternary Ammonium Functional Group for Single Column Ion Chromatography (SCIC)
季铵型键合硅基单柱离子色谱柱填料的研制
17.
Chromatographic column: the most commonly used filler of chromatographic column is chemically bonded silica gel.
色谱柱最常用的色谱柱填充剂为化学键合硅胶。
18.
And ester-Cig silica bonded phase was prepared indirectly using the silane coupling agent as intermediate.
采用间接法制得酯型十八烷基硅胶键合相。