1.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
2.
Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders
Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响
3.
The Effect of Sn on Structure and Property of Mg-Al-Zn-RE Creep Resistant Magnesium Alloy;
Sn对Mg-Al-Zn-RE抗蠕变镁合金性能与组织的影响
4.
The Preparation and Research of the Al-Si-Cu-Sn-Zn Multi-Aluminum Solder
Al-Si-Cu-Sn-Zn多元铝基钎料的制备与研究
5.
Effects of Ga and Al Additions on Corrosion Resistance and High-Temperature Oxidation Resistance of Sn-9Zn Lead-Free Solder
Ga、Al对Sn-Zn钎料耐蚀及高温抗氧化性能的影响
6.
Effect of the Addition of Al or in on the Microstructural Formation of Sn-Ag-Zn Solder and the Exploration of the Soldered Interface;
Al、In对Sn-Ag-Zn焊料组织形成的影响及连接界面的研究
7.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
8.
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
9.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
10.
Study on Preparation and Gas-sensing Propertiy of Zn Ti and Zn Sn Co-sputtering Thin Films
Zn、Ti和Zn、Sn共溅射膜的制备及气敏性研究
11.
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
12.
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
13.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
14.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
15.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
16.
Effects of Alloying Elements on Performance of Sn-Zn Solder
合金化元素对Sn-Zn钎料性能的影响
17.
Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating
Cu-Sn-Zn三元无氰仿金电镀工艺研究
18.
Effects of oxidation on wettability of Sn-Zn alloys
氧化对Sn-Zn系无铅焊料润湿性的影响