1.
UDP Package Method Based on the IPSEC and NAT Technology
基于IPSEC和NAT技术的UDP封装方法
2.
A Service-Oriented Partitioning and Encapsulation Method for Java Legacy Systems
一种Java遗留系统服务化切分和封装方法
3.
Test method for leaks in sealed flexible packages
GB/T15171-1994软包装件密封性能试验方法
4.
testing methods for sealed flexible packages
软包装件密封性能试验方法
5.
Optimization of SPC Control Limit Calculation Method of Assembly Process
封装工艺中SPC控制限计算方法的优化
6.
Our special canning process seals the flavor in.
我们的特殊装罐方法可以把味道密封起来。
7.
RESEARCH ON A METHOD OF SHIELDED HEU ATTRIBUTION MEASUREMENT
探测封装浓缩铀属性的γ无损分析方法
8.
A Study on the Measurement System Analysis in Photoelectronl Semiconductor Assembly;
光电半导体封装测量系统能力分析方法研究
9.
Integrated life prediction method of ball grid array soldered joint
球栅阵列封装焊点寿命预测的综合方法
10.
Improvement on fixing seal strips of hydroturbine guide-vane of Gaobazhou Hydropower Plant
高坝洲电厂水轮机导叶密封安装方法改进
11.
TQFP (Thin Plastic Quad Flat Pack
薄型方面平面封装)
12.
Sewn case cover: Binding process in which section sewn signatures are fastened to a case. Distinct from Perfect case binding.
硬皮线装:装订方法之一；它把锁线订后的各帖，装入封壳内，有别于胶脊精装。
13.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
14.
The method of measuring the lead-to-lead and loading capacitance of package leads
GB/T16526-1996封装引线间电容和引线负载电容测试方法
15.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究
16.
Study on Measurement of Packaging-Induced Stress in High-Power Diode Laser Arrays
大功率二极管激光线阵封装中的应力检测方法研究
17.
Finite Element Analysis of Chip-on-Glass Warp Behavior Due to the Thermal and Mechanical Loading
用有限元方法分析玻璃载芯片封装中的热力耦合问题
18.
Approach on Testing Method for Lead-in Device with Sealing Ring Used in Flameproof Electrical Equipments
隔爆型电气设备密封圈式引入装置试验方法的探讨