1.
The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method.
在硅／玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。
2.
Interfacial Reactions and Alignment for Fiber Bonding by Laser Soldering;
光纤激光钎焊键合过程中界面反应及对准研究
3.
Study on Transmission Laser Bonding and Its Parallel Micro Manipulation;
激光穿透键合机理及其并联微操作平台的研究
4.
Study on Fabrication of Conductor by Microjet and Laser Hybrid Direct Writing Method;
微喷和微喷/激光复合直写导体关键技术的研究
5.
Study on the Key Technique of Thick Film Sensor Fabrication by Micropen-Laser Hybrid Direct Writing Technique
微笔—激光复合直写厚膜传感器的关键技术研究
6.
The Studies on Yb:YAG Direct Bonding Waveguide Laser by End-pumping of LDs
LD端泵浦Yb：YAG直接键合波导激光器的研究
7.
Developing technologies and key problems of inverse synthetic aperture lidar
激光雷达逆合成孔径成像技术现状及关键问题
8.
Interfacial reaction between solder alloys and metallization during laser solder bonding process for optical fiber alignment
光纤定位激光钎焊键合过程中钎料与镀层的界面反应
9.
Study on the Pulse Width of LD End Pumped Acousto-optics Q-switched Laser
LD端面泵浦Nd∶YVO_4/YVO_4键合晶体声光调Q激光脉宽研究
10.
Research on All Solid-State Laser Baseed Bonded Technology and OPO;
基于键合技术的全固态激光器及参量振荡的研究
11.
The Research on Key Technology of Auto Body Coordinate Laser Scanning System Basing on Collaboration Target
基于合作靶标的激光扫描车身坐标测量关键技术研究
12.
ciplex dye laser
复合受激态染料激光器
13.
continuous wave fiber coupled laser
连续波光纤耦合激光器
14.
An Investigation of Laser Alloying and Laser Cladding on Magnesium Alloys;
镁合金激光合金化与激光熔覆的研究
15.
Key words: Laser remanufacturing; Temperature field; Molten pool; CCD.
关键词：激光再制造；温度场；熔池；CCD。
16.
Study on the Key Techniques of an Acquisition Tracking and Pointing System in Wireless Laser Communication;
无线激光通信中ATP关键技术研究
17.
Research on Key Technologies for Wireless Optical Networks;
无线激光通信网络中关键技术的研究
18.
Researching on Several Critical Technologies of Laser Warning System;
激光告警系统中几个关键技术的研究