1.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
2.
PACKAGING OF WAVEGUIDE DEVICES BASED ON BULK SILICON MEMS TECHNOLOGY
基于体硅微机械工艺的光波导器件封装技术
3.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
4.
Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
用低温圆片键合实现传感器和微电子机械系统器件的集成和封装
5.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
6.
Effect of Hydrogen on the Reliability of Microelectronic Devices
氢对金属封装密封元器件可靠性的影响
7.
Device level vacuum packaging technologies of MEMS gyroscopes
MEMS陀螺仪器件级真空封装技术
8.
A technique of converting web documents into component based on wrapper
一种基于封装器的Web文档构件化技术
9.
Thermal Analysis of LED Packages based on Heat Pipe Heat Sink
基于热管散热的LED器件封装热分析
10.
Electron-induced Damage of CMOS with Shielded Packages
屏蔽材料封装CMOS器件的电子辐照损伤
11.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
12.
Current Situation of High-Power LED Encapsulant
大功率LED器件封装材料的研究现状
13.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
14.
Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability
封装材料的吸湿特性及湿、热对封装器件可靠性的影响
15.
General specification for electronic components plastic packaging equipments
GB/T13947-1992电子元器件塑料封装设备通用技术条件
16.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
17.
Performance of a silicon-based embedded MMCM package
一种硅埋置型微波多芯片组件封装的电性能
18.
STRUCTURE AND ANALYSIS OF A COMPACT DEWAR BOTTLE PACKAGE OF INFRARED DETECTOR
红外探测器封装微型杜瓦瓶结构与分析