1.
Large Area Hybrid--An Advanced Microelectronic Packaging Concept
大面积混合电路——一种先进的微电子组装概念
2.
Study on Long Term Reliabilty of ECA for Microelectronic Package;
微电子组装用导电胶长期可靠性的研究
3.
The Research on Reliability and Pb Contamination of Microelectronic Assembly Solder Joints;
微电子组装焊点可靠性及其铅污染问题的研究
4.
Solder Joint Shape Prediction of Microelectronics Assembly Surface Mount Component
微电子组装表贴元件焊点三维形态预测
5.
The application of the finite element numerical simul ation ofstress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
6.
microelectronic modular assembly
微电子学微型组件装置
7.
In Situ Sign of Self-assembled Molecule on Electrode Using QCM;
电极分子自组装石英晶体微天平原位表征
8.
hybrid microassembly
混合集成电路微组装
9.
A self-contained assembly of electronic components and circuitry, such as a stage in a computer, that is installed as a unit.
微型组件一组装在一起的电子元件或电路，作为一个单元被安装，如计算机中的一个装配步骤
10.
MITE (Microelectronic Integrated Test Equipment)
微电子集成试验装置
11.
Microstructure and Properties of SiCp/Cu Composites for Electronic Packaging;
电子封装用SiCp/Cu复合材料的微观组织与性能研究
12.
Study of Porphyryin Self-assembled Monolayers on Gold Electrode by Scanning Electrochemical Microscopy(SECM);
卟啉自组装单分子膜的扫描电化学显微镜（SECM）研究
13.
The Characterization and Electronic Transport Research on Self-assembled Layers by Scanning Probe Microscopy;
利用扫描探针显微镜对自组装分子膜的表征以及电输运特性研究
14.
Self-assemble of Nanoparticles in Microreactor and Investigation of PANI Supercapacitors
微反应器内金属粒子的自组装及聚苯胺超级电容器的研究
15.
packaging and construction of electronic equipment
电子设备组装与结构
16.
Polymer-Assisted Micro-Scale Assembly of ZnO Nanosheets
微观尺度高分子协同组装ZnO纳米片
17.
Synthesis of micro/mesopous zeolites by degrading zeolite NaY as precursors and using CTMABr as a template
降解-CTMABr组装介-微孔分子筛的实验研究
18.
Patterning Macromolecules and Microcapsules by Soft Lithography;
软刻技术制备大分子微图案及微胶囊定向组装