1.
Presentation of reliability data on electronic components(or parts)
GB/T6991-1986电子元器件可靠性数据表示法
2.
Percolation Methodology for the Modeling and Simulation of the Reliability Issues of Microelectronics Devices;
微电子器件可靠性建模与仿真的逾渗分析方法
3.
Application of the Weibull Distribution on the Evaluation of the Eletronic Component Operation Reliability
威布尔分布在电子元器件可靠性评估中的应用
4.
Acceptance and reliability for discrete semiconductor devices
GB/T4938-1985半导体分立器件接收和可靠性
5.
Reliability Diagnostic Methods by Means of Noise in Semiconductor Devices;
半导体器件噪声—可靠性诊断方法研究
6.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
7.
Study on the Structure and Reliability of Deep Submicrion SDE MOSFET;
深亚微米SDE MOS器件结构及可靠性研究
8.
On the mode and cycle of invalidation of electronic components and their reliability;
电子元器件的失效模式、周期与可靠性
9.
Research on Software Reliability Test Methods for Autonomous Underwater Vehicles
水下机器人软件可靠性测试方法研究
10.
Rework of QFP Applied to Aerospace Products
航天产品新型QFP器件高可靠性返修
11.
Reliability analysis of PBGA soldered joints based on Taguchi method
基于田口法的PBGA器件焊点可靠性分析
12.
Finite element analysis on reliability of lead-free soldered joints for CSP device
CSP器件无铅焊点可靠性的有限元分析
13.
Reliability evaluation of FOG based on key apparatus
基于关键器件的光纤陀螺可靠性评估
14.
Analysis on soldered joint reliability of PBGA package with different arrangement models
不同阵列PBGA器件焊点可靠性分析
15.
Reliability for Microcantilever Device Manufacture Craft
微悬臂梁器件制作工艺的可靠性研究
16.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
17.
Reliability Research on Solder Joint of Plastic Ball Grid Array Component
PBGA器件焊点的可靠性分析研究
18.
Redundant Reliability Fault-Tolerant Software of Central Contraller Strdy on Spatial Robot;
空间机器人中央控制器可靠性软件容错研究