1.
The Main Factors Causing Die Crack in IC Assembly Process
IC封装中引起芯片裂纹的主要因素
2.
Study on Microdamage of Thin Wafer Sawing and Die Break Strength
薄片划片微损伤与芯片断裂强度探讨
3.
A core was removed from this area so that the crack surfaces could be examined.
从这一区域取样芯，以便检验裂纹表面。
4.
They are fatigue cracks which is mainly caused by alternating stress.
叶片裂纹是疲劳裂纹,主要由交变应力引起。
5.
A System Design of Fingerprint Data Acquisition Based on SOC Chip
基于SOC芯片的指纹数据采集系统设计
6.
The Numerical Simulation of Mandrel Fatigue Total Life and Crack Growth;
芯辊疲劳全寿命和裂纹扩展的数值模拟
7.
A craze is a thin platelike region.
小裂纹是一个类似薄片的区域。
8.
The Analysis of Crystal Crack of T23 Waterwall Tube-fin
T23水冷壁管排鳍片焊缝裂纹的分析
9.
Repair efficiency of cracked panel repaired by a piezoelectric patch
利用压电补片修补裂纹板的效能分析
10.
A New Fingerprint pattern Processing Chip FPC2000 And Its Application;
一种新型指纹模式处理芯片FPC2000及其应用
11.
Application Of VFS131 FingerprintClip On System Security
基于VFS131指纹芯片在系统安全方面的应用
12.
Antibodies are spotted onto the chips and cell lysate or a solution is applied to the slide.
发现抗体芯片和细胞裂解或走上办法适用于滑.
13.
Fracture Analysis of Stainless Steel Belts for Tin Plating Chip Lead Frame
芯片引线框架镀锡用不锈钢带断裂失效分析
14.
Crack- A mark found on a wafer that is greater than0.25 mm in length.
裂纹-长度大于0.25毫米的晶圆片表面微痕。
15.
Basic Research on Acquisition of AE Signal of Cracks in Francis Turbine Runner Blades;
转轮叶片裂纹声发射信号获取的技术基础研究
16.
Analysis and Treatment of Hydraulic Turbine Blade Cracks of Ankang Hydropower Plant
安康水电厂水轮机叶片裂纹分析及处理
17.
Crack Analysis and Research on Compressor Blades in a Typical Aeroengine
发动机压气机整流器叶片裂纹成因及对策研究
18.
Detecting Vane Cracking of Hydraulic Turbine with Acoustic Emission Technology
基于声发射技术的水轮机转轮叶片裂纹检测