1.
Selection of Solder Paste in Electronic Assembly
电子组装中无铅焊膏的选择(续完)
2.
Study of active substance for SnAgCu lead-free solder paste
SnAgCu无铅焊膏用活性物质研究
3.
The Synthesis of the New Activator and Applied in the Lead-free Solder Paste
新型活化剂的合成及在无铅焊膏产品上的应用
4.
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
5.
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
6.
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
7.
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
8.
Application of Hydroxy-alkyl-amine to Lead-free Solder Paste
烷基羟基胺在无铅焊锡膏制备中的应用
9.
The Improvement of the Solder Paste Performance and the Effect of Composition on It;
SMT无铅焊锡膏性能的改进及其组份对性能的影响
10.
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
11.
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
12.
Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing
内置无铅锡膏印刷机的检测算法研究
13.
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
14.
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
15.
Application and Development of Surface Mount Technology;
从有铅向无铅焊接过渡阶段应注意的问题
16.
Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering;
无铅回流焊冷却速率对焊点质量的影响
17.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
18.
Study of Organic Activated Flux for Sn-9Zn Lead-free Solder;
Sn-Zn无铅电子焊料有机活化助焊剂研究