1.
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
2.
Study on the Interfacial Reaction and Reliablity of Solder Bumps Reflowed by Induction Heating
感应加热重熔焊点界面反应及可靠性研究
3.
Study of Intermatallic Compounds and Kirkendall Voids in Solder Joints of Lead-free Solder
无铅焊点界面化合物及Kirkendall空洞实验研究
4.
Finite Element Simulation of Interfacial Fracture Behavior of Microscale Lead-free Interconncts and the Influence of Electromigration and Isothermal Aging
无铅微互连焊点界面断裂行为及其电迁移和热时效影响的有限元模拟
5.
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint
P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响
6.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
7.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
8.
The Morphology and Aging Evolution of IMC in low-Ag SnAgCu Soldering
低银无铅焊点的界面化合物形貌与演变
9.
monoside twin shots welder(KD-16)
单面双点点焊机（KD-16）
10.
monoside twin shots welder(KD-17)
单面双点点焊机（kd-17）
11.
Microstructure investigation for the interface of electric resistance welded Cu/Al thin walled tube
薄壁铜铝管电阻焊焊接界面的微观结构研究
12.
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
13.
Nanocrystalline structure at explosive weld interface of 321 and Qd370qD steels
321钢/Qd370qD钢爆炸焊接界面纳米晶组织
14.
Microstructure of cementite beside interface in 321/Qd370qD explosive welding
321/Qd370qD爆炸焊接界面渗碳体的微观结构
15.
The Growth Behavior of Interfacial IMC of Sn-0.7Cu/Cu by Laser Braze Welding
激光钎焊Sn-0.7Cu/Cu界面IMC生长行为
16.
Interfacial reaction of active brazing between Al_2O_3 ceramic and metal Ni
Al_2O_3陶瓷与金属Ni活性钎焊界面反应
17.
Microstructural Features Beside Interface in 321/Qd370qD Explosive Welded Plate
321/Qd370qD爆炸焊接界面渗碳体特征
18.
Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate
微量Ce对SnAgCu焊料与铜基界面IMC的影响