1.
Nitto Denko Semiconductor Related Epoxy Molding Compound Strategic Analysis of China Market;
日东电工半导体用环氧树脂塑封料中国市场策略研究
2.
Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;
环氧树脂灌封材料的制备与性能研究
3.
Can strips of plastic Be united with epoxy?
塑料带可以用环氧树脂黏合起来吗?
4.
epoxy seal transistor
环氧树脂封装晶体管
5.
epoxy enclosed transistor
环氧树脂密封晶体管
6.
Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
环氧树脂片状模塑料潜伏性固化体系研究
7.
Polyisocyanurate Foamed Plastic Modified by Bisphenol A-epoxy Resin
双酚A环氧树脂改性聚异氰酸酯泡沫塑料
8.
DEVELOPMENT OF EPOXY/EPOXY-SILSESQUIOXANE HYBRID MATERIAL FOR LED PACKAGING
LED封装用环氧树脂/环氧倍半硅氧烷杂化材料的研制
9.
Effect of thermoplastic phenolic resin on properties of carbon fibers reinforced resin matrix composites
热塑性酚醛树脂对碳纤维环氧树脂基复合材料性能的影响
10.
epoxy polyester powder coating
环氧聚酯树脂粉末涂料
11.
epoxy resin powder coatings
涂料用环氧树脂粉末
12.
fusion bonded epoxy power coating
熔结环氧树脂粉末涂料
13.
Fabrication and Properties of Aluminum Oxide Filled Epoxy Encapsulates for Pulse Power Supplier;
脉冲电源用氧化铝/环氧树脂封装材料的制备关键技术与性能测试
14.
Analysis on the Relation between EMC Property and Packaging Defect
浅析环氧塑封料性能与器件封装缺陷
15.
The preparation and properties of superfine glass powder/epoxy resin composites were studied.
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
16.
The Preparation and Property Research of Epoxy Resin Based Electric Electronic Packaging Material;
环氧树脂电力、电子封装材料的制备及其性能研究
17.
Studies on the Sealant Using Expoxy Modified Arylic Resin and Nano-SiO_2 Composite Material;
密封胶用环氧改性丙烯酸树脂及纳米复合材料的工艺研究
18.
Study on Synthesis and Performances and of Epoxy Resin Materaials Used in Elexctronic Packaging
电子封装材料用新型环氧树脂的制备及性能研究