1.
Average-Bond-Energy and Fermi Level on Metal-Semiconductor Contacts
金属-半导体超晶格中的金属费米能级和半导体平均键能
2.
The Mean Value Survey Law for Thermal Resistance Test of Power Semiconductor Radiator
电力半导体散热器热阻测试中的平均值测量法
3.
Hole Compensation Effect and A-site Radius Effect Studies on La-based Cuprate Superconductors
铜氧化物高温超导体空穴补偿效应和A位平均离子半径效应研究
4.
Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding in Semiconductor Packaging;
单晶铜丝在半导体器件封装中的打线键合性能研究
5.
Gold wire for semiconductor devices lead bonding
GB/T8750-1997半导体器件键合金丝
6.
Fine aluminum-1% silicon wire for semiconductor lend-bonding
GB/T8646-1998半导体键合铝--1%硅细丝
7.
Key Techniques in Electrically Pumped Organic Semiconductor Laser
电泵浦有机半导体激光器的关键技术
8.
Relationship between Average Velocity and Radius in Round Pipe Fluid Flow;
圆管流体平均流速与管道半径的关系
9.
semiconductor energy converter
半导体能量转换器件
10.
a semiconductor device capable of amplification.
能够扩大的半导体装置。
11.
According to this procedure, general solutions of semi-infinite viscoelastic body under vertical and horizontalcircular uniform load are developed.
按此方法,本文导出了垂直和水平圆形均布荷载下半空间弹粘性体的一般解。
12.
The Flatness Technology of Semiconductor Surface and Study of Advanced Bran-New Wet Cleaning Methods;
半导体表面平坦化及新型高性能湿式清洗工艺的研究
13.
RESEARCH ON IRRADITION FIELD UNIFORMITY OFSEMICONDUCTOR LIGHT BAR AS RADIOMETRICCALIBRATION SOURCE
半导体发光条辐射定标源辐照场均匀性的研究
14.
Synthesis of Semiconductor Nanomaterial by Coordination-homogeneous Precipitation Method
纳米半导体材料的配位—均匀沉淀法合成
15.
Key Technology Research of GaN Based Metal-ferroelectric-semiconductor Field Effect Transistor;
GaN基金属—铁电体—半导体场效应晶体管关键技术研究
16.
Study of Ⅲ-Ⅴ MQW Planar Waveguide Light-device;
Ⅲ-Ⅴ族半导体MQW平面波导光器件的研究
17.
mean hemispherical intensity
平均半球面发光强度
18.
mean lower hemispherical intensity
平均下半球面烛光度