1.
Mechanical Characterization for Low-k Film of ULSI Interconnects by LSAWs;
LSAWs技术表征ULSI互连布线Low-k介质薄膜机械特性的研究
2.
Algorithm Research on Measuring the Young's Module for Low-K Film of ULSI Interconnects by Lsaws
LSAWs技术检测ULSI互连布线low-k介质薄膜杨氏模量的算法研究
3.
Studies on Microstructure and Stress of Copper Interconnects in ULSI;
ULSI铜互连线微观结构和应力研究
4.
Microstructure and Stress of ULSI Cu Interconnects and Their Impacts on Electromigration;
ULSI铜互连线微结构与应力及其对电徙动影响的研究
5.
Study on CMP Slurry of ULSI Copper Interconnection Layer;
ULSI铜互连层CMP抛光液研究
6.
Study on the Removal Rate of CMP for Tungsten Plug in ULSI
ULSI多层互连中W-CMP速率研究
7.
Study of Thermal Effect and Reliability of Multilevel Metal Routing in ULSI;
ULSI多层金属布线中的热效应和可靠性研究
8.
Analysis and Research on the Surface Roughness of the Copper Multilayer Interconnection CMP in ULSI
ULSI中多层Cu布线CMP表面粗糙度的分析和研究
9.
FPGA Interconnect Test Algorithm Based on Routing Resource Graph
基于布线资源图的FPGA互连测试算法
10.
A novel temperature-aware distributed interconnect power model
一种考虑温度的分布式互连线功耗模型
11.
Analysis of Coupling Capacitance among Interconnections Based on Defect’s Uniform Distribution
基于缺陷均匀分布的互连线间耦合电容分析
12.
A compact interconnect temperature distribution model considering the via effect and the heat fringing effect
考虑通孔效应和边缘传热效应的纳米级互连线温度分布模型
13.
Stochastic modeling of distributed parameters and analysis of interconnect delay in the presence of process variations
工艺变化下互连线分布参数随机建模与延迟分析
14.
interconnect tape
带有引线架的互连带
15.
Novel Analysis Method for Distributed Parameter Interconnect Networks
分布参数互连网络系统分析方法研究
16.
Do not connect the unit's speaker cords to each other.
不要相互连接本机的扬声器电线。
17.
Simulation of Extremely High Order RC Interconnect Model by MatLab
用MatLab仿真高阶RC模型的互连线特性
18.
Investigation on Several Issues in VLSI Interconnect Process Variations;
VLSI中互连线工艺变化的若干问题研究