1.
The Appliance about System Encapsulayion Technology in University s Computer Management;
系统封装技术在高校计算机管理中的应用
2.
Design of GFP encapsulation and de-encapsulation in EoS system
EoS系统中GFP封装与解封装的设计
3.
Design of the Control System of the Wafer Expanding Device for IC Encapsulation
IC封装的扩晶装置控制系统的设计
4.
Microsystem Technology (Serials Four)──Packaging Technologies
微系统技术（连载四）──封装技术
5.
Research on Soft Measurement of Internal Temperature and Relative Humidity in Sealed Packages;
密封包装箱内温湿度软测量系统研究
6.
Dispensing System Design and Emulation for RFID Packaging;
面向RFID封装的点胶系统设计与仿真
7.
Water Seal Arrangement for Flare Gas Recovery and Its Improvement;
火炬气回收装置水封阀系统应用分析
8.
System-in-Package (SiP) Random Vibration Analysis
系统级封装（SiP）的随机振动分析
9.
Transform of Controlling System of Al Tube Sealing Tail Machine of PLC
PLC铝管灌装封尾机控制系统的改造
10.
Mask Subsystem Design of Boiler Model under Matlab/Simulink
Matlab/Simulink环境下锅炉模块封装子系统设计
11.
Study of Insulated Potting and Encapsulation System to Gasoline Engine Ignition Coil;
汽油机点火线圈的绝缘封装及其灌封系统的研究
12.
The Investigation of 2-DOF High-speed and High-precision Positioning System for IC Packaging;
面向IC封装的两自由度高速精密定位系统研究
13.
Research on Modeling, Control and Implementation of Dispensing System for IC Packaging;
面向半导体封装的点胶系统建模、控制与实现
14.
Design and Implementing of the Machine Vision System in RFID Tag Package Equipments;
RFID标签封装设备中机器视觉系统设计与实现
15.
Mechanism & Control Research of Automatic SOT Taping Machine;
SOT自动编带封装机机械结构与控制系统的研究
16.
Design and Thermal Analysis of Bonding System Used for RFID Tag Packaging;
面向RFID标签封装的固化系统设计及其热分析
17.
Study on System-in-Package Technology of MEMS Air Pressure Sensor;
MEMS气体压力传感器的系统级封装（SiP）技术研究
18.
The Dispensing Control System and The Research of Its Performance Control for IC Packaging;
微电子封装中点胶控制系统及其性能控制研究