1.
Surface Morphology of Glutathione Complex with Cadmium(Ⅱ) and Copper(Ⅱ) via Atomic Force Microscope
谷光甘肽-Cd(Ⅱ)、Cu(Ⅱ)配合物在硅片表面形貌的AFM分析
2.
Study on Surface Morphologies of Copper Films Deposited on Silicone Oil Surfaces
沉积在硅油表面铜薄膜的特征表面形貌
3.
Profilometer - A tool that is used for measuring surface topography.
表面形貌剂-一种用来测量晶圆片表面形貌的工具。
4.
Silicon wafer cleaning method without surface morphology change by sulfuric acid /hydrogen peroxide oxidation
硅基表面无形貌改变的硫酸/过氧化氢氧化清洗
5.
Study on Morphology of Surface Atoms Conformation of Nanogold-based Genechip
纳米金基因芯片表面原子排列构象的形貌研究
6.
Effect of Grain Size of Grinding Wheel on Surface Topography
砂轮粒径对磨削后Si片表面形貌的影响
7.
EFFECT OF ELECTRON BEAM RE-MELTING ON SURFACE MOTPHOLOGY AND PROPERTIES OF SILICIDE COATING
电子束重熔处理对硅化物涂层表面形貌和性能的影响
8.
Preparation of Silica Hollow Microspheres with Special Surface Morphology by Biotemplate Method
生物模板法制备具有特殊表面形貌的二氧化硅中空微球
9.
Surface Topography and Anti-reflection Characteristics of Polycrystalline Silicon Surface Prepared by Electric Discharge-electrolytic Combined Machining
电火花电解复合切割多晶硅的表面形貌及减反射特性研究
10.
Study on the Influence of Surfactants on Morphologies of Trigonal Selenium in Microfludic Reactors
微流控芯片中研究表面活性剂对三方硒形貌的影响
11.
Evolution of silicon phase configuration and Si-Al interface of Si_p/Al composites
Si_p/Al复合材料中的界面和硅相形貌的演变
12.
Multi-metal Microcontamination of Silicon Wafer Surface Characterized by Electrochemical Impedance Spectroscopy
硅片表面多金属污染的交流阻抗表征
13.
Fractal characterization of surface morphology of Cu/TaN multilayer films
Cu/TaN多层膜的表面形貌分形特征
14.
The Morphology of 5-fold Surface on the AlPdMn Quasicrystal;
AlPdMn准晶体5次面表面形貌
15.
Quantitative Characterization for Surface Morphology of Interfacial Transition Zone (ITZ) in Concrete by Fractal Dimension
混凝土界面过渡区表面形貌的分形维数表征
16.
Characterization of Surface Topography and Research on Tribological Properties of Laser Texturing Surface
表面形貌表征及激光微造型表面摩擦特性研究
17.
Test methods for surface flatness of silicon polished slices
GB/T6621-1995硅抛光片表面平整度测试方法
18.
Study on Removal Mechanism of Ductile-Mode Grinding in 300mm Silicon Wafer Surface Grinding Process
300mm硅片表面延性磨削机理研究