1.
The Fiber Bragg Grating and the Sensing Study on the Sensor Encapsulated by the Alloyed Steel;
光纤Bragg光栅及其合金钢封装传感器特性研究
2.
Study on Antibullet Performance of Metal-ceramic Composite Armor
金属封装陶瓷复合装甲抗弹性能研究
3.
Fundamental Study of Novel Si-Al Electronic Packaging Materials
新型电子封装Si-Al合金的基础研究
4.
Research progress of diamond/metal composites for electronic packaging
电子封装用金刚石/金属复合材料研究进展
5.
Comparison of Cu and Au Ballbonding in Microelectronics Packaging
微电子器件封装中铜与金球键合的比较(英文)
6.
Study on the thixoforming of electronic packaging shell with SiC_P and Al alloy
碳化硅铝合金材料触变成形电子封装壳体研究
7.
Research Progress of Diamond-Cu Composite Material for Electronic Packaging
电子封装材料用金刚石/铜复合材料的研究进展
8.
Application of Low Melting Point Alloys to Processing of TC4 Case Packaging
低熔点合金灌注在钛合金封装壳体加工中的应用
9.
However, the welding of dissimilar steels carbon steel or low alloy steel and stainless composite steel demands more welding high-technologies in fabrication and erection of the hydraulic steel structure.
而碳钢、合金钢的复合钢板及异种钢的焊接在水工金属结构制作安装中要求高、度大。
10.
The tully metallized optical fiber insert pin for metallized coupling package of optoelectronic devices is reported for the first time.
本文首次报导光电器件金属化耦合封装用全金属化光纤插针;
11.
Seal Performance Analysis of O-Ring Between Stainless Steel and Aluminum Alloy
不锈钢与铝合金材料之间密封用O形环性能分析
12.
Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy
电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究
13.
OPTIMIZATION OF HOT CHARGING PROCESS OF CC BILLET OF ALLOY STEEL
优化合金钢方坯连铸热装工艺的几点探讨
14.
Study on Forming Mechanism of Hot Charging Cracks in C-Mn-Si Low-alloyed Steel
C-Mn-Si系低合金钢热装裂纹形成机理研究
15.
Microstructure and properties of spray deposition 70%Si-Al alloy for electronic packaging applications
喷射沉积70%Si-Al合金电子封装材料的组织与性能
16.
package guidelines for custom hybrids
专用混合电路封装指南
17.
all other metal seal components of both inner and outer seals shall be aISI 316 stainless steel.
所有内置和外置密封的金属部件都应该是符合美国钢铁协会的316不锈钢。
18.
Packing containers-Closure of drums
GB13251-1991包装容器钢桶封闭器