1.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
2.
The Reliability Analysis and Structure Parameter Opimization of Stacked Die Package;
叠层芯片封装可靠性分析与结构参数优化
3.
Vibration Analysis and Reliability Research of Packaging on LTCC Substrate
LTCC基板的振动分析及其封装可靠性研究
4.
Improving the Reliability of Power MOSFET Package
提高MOS功率晶体管封装可靠性技术研究
5.
Comparative Research of Micro-BGA Reliability Under Bending Stress
弯曲应力状况下微型BGA封装可靠性比较
6.
Impact of Hot-Cutting Defect on Reliability of Ceramic Packaging and a Novel Concept of Structure Design;
热切缺陷对陶瓷封装可靠性的影响和一种结构设计新概念
7.
Finite element analysis on soldered joint reliability of QFN device
QFN封装焊点可靠性的有限元分析
8.
Reliability Analysis of PBGA Devices at Hygrothermal Environment
PBGA封装的耐湿热可靠性试验研究
9.
Reasearch on Encapsulation Technology Reliability of High Power White-Light LED
大功率白光LED封装技术可靠性研究
10.
Reliability of SOP Component Solder Joint
小尺寸封装(SOP)器件焊点可靠性研究
11.
Effect of Hydrogen on the Reliability of Microelectronic Devices
氢对金属封装密封元器件可靠性的影响
12.
Study on the Reliability of SMT Solder Joint in Electronic Packaging;
电子封装中表面贴装焊点的可靠性研究
13.
Moisture Absorption Property of Material and Moisture&Thermal Affects on Package's Reliability
封装材料的吸湿特性及湿、热对封装器件可靠性的影响
14.
Kiln head seal person who adopts clamshell seal, kiln tail equips with the contact-type sealinstallation of the axial, have guaranteed sealed dependability.
窑头密封采用了壳罩式密封，窑尾装有轴向接触式密封装置，保证了密封的可靠性。
15.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
16.
Research on Reliability of Au80Sn20 Solder Joint for Laser Diode Packages;
在激光二极管LD封装中Au80Sn20焊点的可靠性研究
17.
Interfacial Evolution and Reliability of Lead-Free Solder Joints for Electronic Packaging;
电子封装中无铅焊点的界面演化和可靠性研究
18.
A Study on Interface Failure Analysis and Reliability for High Temperature Electronic Packaging
高温电子封装界面失效分析及可靠性研究