1.
Application of Plasma Cleaning in LED Package Process
等离子清洗在LED封装工艺中的应用
2.
Development of Packaging Design of High-Power White LED
功率型白光LED封装设计的研究进展
3.
Failure analysis of die attach adhesive for encapsulation SMT LED
SMT LED封装用固晶胶的失效分析
4.
Reasearch on Encapsulation Technology Reliability of High Power White-Light LED
大功率白光LED封装技术可靠性研究
5.
Comparison between Two Electrodes for High-Power LED Packaging
两种新型大功率LED封装电极层的比较
6.
Research & Fabrication of Packaging Technology for High-Power White LED
大功率白光LED封装工艺技术与研制
7.
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
8.
Synthesis of Liquid Crosslinking Agent for Light Emitting Diode Encapsulant
LED封装用液体交联剂的制备与表征
9.
Advance in Silicone Materials for LED Encapsulation
LED封装用有机硅材料的研究进展
10.
Thermal Management and Aging Test of High-Power White LED;
高功率白光LED封装热设计及其老化特性的研究
11.
Study on Preparation and Performance of Aluminum Substrate for Heat Dissipation of High-power LED
大功率LED封装用散热铝基板的制备与性能研究
12.
Fxploring the Outdoor Lighting System Design from the LED Package
从LED封装探究户外照明灯具的系统设计
13.
Preparation and Optical Properties of Transparent Epoxy Nanocomposites as Encapsulating Materials for LED Chips;
LED封装用透明环氧纳米复合材料的制备及性能研究
14.
Study on Ultraviolet Resistance of Modified Epoxy Resin with Nano ZnO;
纳米ZnO改性LED封装用环氧树脂的抗紫外老化研究
15.
Process Mechanics Modeling of Pressure Sensor Packaging and High-Brightness LED Packaging;
微压力传感器和白光LED封装的工艺力学数值模拟
16.
Research on Packaging of White High-Brightness LEDs;
白光高亮度发光二极管（HB-LED）封装研究
17.
Study of the attenuation characteristic of white light-emitting diode by different package
不同封装白光LED衰减特性的研究
18.
Study on luminous decay of φ5 white light emitting diode
封装对φ5白光LED寿命的影响研究